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Find similar grantsCHIPS Incentives Program: Facilities for Semiconductor Materials and Manufacturing is sponsored by U.S. Department of Commerce (CHIPS Program Office). This funding opportunity supports the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.
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Opportunity Listing - CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment Agency: National Institute of Standards and Technology Assistance Listings: 11. 037 -- CHIPS Incentives Program Last Updated: October 16, 2025 View version history on Grants.
gov The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.
For more information, additional resources, and instructions on how to apply, please visit chips. gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications. chips.
gov . If you have any questions on how to apply, please email apply@chips. gov. An applicant must be a “covered entity” to receive CHIPS Incentives.
For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
Grantor contact information File name Description Last updated CHIPS_-_Facilities_for_Semiconductor_Materials_and_Manufacturing_Equipment_NOFO. pdf 2023-NIST-CHIPS-SMME-01 Sep 27, 2023 08:40 PM UTC 2023-NIST-CHIPS-SMME-01-Amendment.
pdf 2023-NIST-CHIPS-SMME-01 Amendment Oct 16, 2025 08:46 PM UTC Link to additional information Closing: November 1, 2026 Funding opportunity number : Cost sharing or matching requirement : Funding instrument type : Opportunity Category Explanation : Category of Funding Activity : Science technology and other research and development
Based on current listing details, eligibility includes: All eligible applicants, including businesses, non-profits, and schools. Organizations proposing workforce training must partner with educational entities and show evidence of semiconductor employer support. Applicants should confirm final requirements in the official notice before submission.
Current published award information indicates Funding amounts vary based on project scope and sponsor guidance. Always verify allowable costs, matching requirements, and funding caps directly in the sponsor documentation.
The current target date is November 1, 2026. Build your timeline backwards from this date to cover registrations, approvals, attachments, and final submission checks.
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