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Concept papers due May 27, 2026 at 5:00 p.m. PT. Full applications open July 2026, with selection notifications in October 2026.
High-Performance Computing for Manufacturing (HPC4Mfg) program is sponsored by U.S. Department of Energy (DOE) Office of Critical Minerals and Energy Innovation (CMEI) / Advanced Materials and Manufacturing Technologies Office (AMMTO) and Industrial Technologies Office (ITO). This program supports projects that improve America's manufacturing competitiveness through the use of powerful supercomputers.
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Funding Notice: Over $10 Million Available for High-Performance Computing Innovation Program | Department of Energy Funding Notice: Over $10 Million Available for High-Performance Computing Innovation Program DOE will award up to $400,000 to small and medium-sized manufacturers and their National Laboratory, university, and non-profit partners.
Advanced Materials & Manufacturing Technologies Office The HPC4Mfg program uses powerful supercomputers, housed at DOE National Laboratories, to advance America’s manufacturing and industrial competitiveness.
Offices: Advanced Minerals and Materials Technologies Office (AMMTO) and Industrial Technologies Office (ITO) Solicitation Number : HPC4EI-2026SP-RN-SOL Funding Amount: Up to $400,000 per project The U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) today announced a new solicitation for projects that improve America’s manufacturing competitiveness through the use of powerful supercomputers.
DOE will award up to $400,000 to small and medium-sized manufacturers (SMMs) and their National Laboratory, university, and nonprofit partners. In total, DOE will make over $10 million available for potential selections. Projects funded through this solicitation will accelerate the development of new materials and improve manufacturing and industrial processes through artificial intelligence, machine learning, and digital simulation.
All U.S.-based SMMs are eligible to apply, in partnership with universities, institutes, and other non-profit organizations. Selected teams will work with staff from one or more DOE National Laboratories to advance their material designs and solve their manufacturing challenges.
DOE's High-Performance Computing for Manufacturing (HPC4Mfg) program, part of the High-Performance Computing for Energy Innovation (HPC4EI) initiative, is funded by both DOE’s Advanced Materials and Manufacturing Technologies Office (AMMTO) and Industrial Technologies Office (ITO). HPC4EI is managed by Lawrence Livermore National Laboratory. Visit the HPC4EI website for additional information .
Applicants must submit concept papers by May 27, at 5:00 p. m. PT to be eligible for full applications.
Topic Area 1: CMEI’s Advanced Materials and Manufacturing Technologies Office (AMMTO) Proposals for AMMTO should demonstrate credible pathways to advancing American manufacturing competitiveness, improving supply chain security, enhancing energy system reliability, and creating high-quality domestic jobs.
Areas of interest include the development of: Advanced materials to improve the performance, durability, and cost-effectiveness of energy systems and technologies. Manufacturing processes to strengthen U.S. industrial competitiveness and energy security.
Topic Area 2: CMEI’s Industrial Technologies Office (ITO) Proposals for ITO should demonstrate potential to strengthen global competitiveness of the U.S. industrial sector, reduce the energy intensity of industrial processes, improve the reliability of energy infrastructure, and onshore industrial excellence.
Areas of interest include the development, optimization, scale-up, and integration of: Technologies that significantly improve productivity optimization in energy-intensive industries to bolster manufacturing competitiveness. Equipment and processes that improve industrial process heating, including reducing cost, improving efficiency, or enhancing product quality. Eligibility is limited to U.S. manufacturers.
U.S. universities, institutes, and other non-profit organizations are also eligible to participate as collaborators. The solicitation encourages applicants to partner with a range of universities, community colleges, and non-profit organizations.
Funding opportunity released: April 28, 2026 Concept Papers Due: May 27, 2026 Full Applications Open: July 2026 Full Applications Due: August 2026 Expected Date for Selection Notifications: October 2026 Additional Information Download the full funding opportunity . For solicitation-specific support, contact the HPC4EI program at hpc4ei@llnl.
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Based on current listing details, eligibility includes: U.S.-based small and medium-sized manufacturers (SMMs) in partnership with universities, institutes, and nonprofit organizations. Applicants should confirm final requirements in the official notice before submission.
Current published award information indicates Up to $400,000 per project; over $10 million total available Always verify allowable costs, matching requirements, and funding caps directly in the sponsor documentation.
The current target date is May 27, 2026. Build your timeline backwards from this date to cover registrations, approvals, attachments, and final submission checks.
Federal grant success rates typically range from 10-30%, varying by agency and program. Build a strong proposal with clear objectives, measurable outcomes, and a well-justified budget to improve your chances.
Requirements vary by sponsor, but typically include a project narrative, budget justification, organizational capability statement, and key personnel CVs. Check the official notice for the complete list of required attachments.
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Academic Grant Program is sponsored by NVIDIA. NVIDIA's Academic Grant Program seeks proposals from full-time faculty members at accredited academic institutions using NVIDIA technology to advance work in Simulation and Modeling, Data Science, and Robotics and Edge AI. Proposals for the NVIDIA Graduate Fellowship Program are also invited, focusing on AI, robotics, and autonomous vehicles.
Manufacturing USA Institute – AI for Resilient Manufacturing is sponsored by National Institute of Standards and Technology (NIST). NIST is seeking applications to establish and operate a Manufacturing USA institute focused on leveraging artificial intelligence to strengthen the resilience of U.S. manufacturers, particularly concerning supply chain networks. The institute will conduct applied R&D projects and cultivate a skilled workforce.
America's Seed Fund (SBIR/STTR) - Cybersecurity and Authentication is sponsored by U.S. National Science Foundation (NSF). Supports startups and small businesses to translate research into products and services, including cybersecurity and authentication, to secure national defense and protect the public. Includes research requiring privacy and security-preserving resources for artificial intelligence.