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International Technology Security and Innovation (ITSI) Fund is sponsored by U.S. Department of State. Promotes the development and adoption of secure and trustworthy telecommunications networks and ensures semiconductor supply chain security and diversification.
Funding will also train and incubate the next generation of ICT and innovation leaders by connecting partners with U.S. universities and U.S. research institutions to build medium- to long-term capacity and create linkages with U.S. industry.
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In August 2022, Congress passed the CHIPS Act, a U.S. federal statute that provides billions of dollars in new funding to boost domestic research and manufacturing of semiconductors in the United States.
The International Technology Security and Innovation (ITSI) Fund, appropriated under the Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act of 2022, provides the Department of State with $500 million — $100 million per year over five years, starting in Fiscal Year 2023 — to promote the development and adoption of secure and trustworthy telecommunications networks and ensure semiconductor supply chain security and diversification.
The ITSI Fund is separate and distinct from funding appropriated to the Department of Commerce and other agencies under the same Act. Semiconductors and telecommunications networks are critical global economic sectors.
Securing and strengthening the world’s long-term economic security and stability hinges on the ability to stabilize and expand semiconductor manufacturing, bring cost-competitive trustworthy suppliers to the telecommunication market, secure semiconductor supply chains, and invest in innovation that will drive the next generation of semiconductor technologies.
When any one country tries to control global telecommunications networks or semiconductor supply chains, they have the means to manipulate or disrupt essential services, critical infrastructure, and supply chains with the push of a button. Should adversaries dominate these sectors, they will be better able to export authoritarian practices and undermine democratic governance.
In order to reduce those risks and bolster global economic security, the CHIPS Act enables strategic U.S. investments in these critical sectors. The ultimate goal is to bring new trusted information and communications technology vendors and semiconductor production capacity into the global market, in ways that will directly benefit the United States as well as our allies and partners.
(From left to right) Costa Rica Vice Minister of Foreign Trade Indiana Trejos, Costa Rica Minister of Foreign Trade Manuel Tovar Rivera, U.S. Ambassador to Costa Rica Dr. Cynthia A.
Telles, Costa Rica Minister of Science, Innovation, Technology and Telecommunications, Paula Bogantes Zamora, and Jeffrey Goss, Associate Vice Provost and Executive Director of Global Outreach and Extended Education at Arizona State University, pose at the inaugural workshop on human talent development and public policies under the Department of State’s ITSI Fund in San José, Costa Rica.
The U.S. government recognizes that U.S. leadership and strong international cooperation are critical to maintaining a stable, reliable supply chain for semiconductors. To ensure a more diverse, resilient, and secure global semiconductor supply chain, ITSI funding will support the following efforts: * **Securing Critical Material Inputs.
** Semiconductor fabricators require access to critical minerals such as aluminum, arsenic, cobalt, copper, and rare earth elements. Several nations around the world have relevant mineral resources, and the Department will lead an effort to bring new, more diverse and resilient mining, refining/processing, and recycling capacity online to support global chip production, including in the United States.
* **Strengthening International Policy Coordination**. In conjunction with the Department of Commerce, the State Department will coordinate with partner economies to support a more resilient and diverse semiconductor supply chain. These activities include developing common or complementary approaches to industry incentives, as well as improving coordination during supply disruptions.
* **Expanding and Diversifying Downstream Capacity in the Indo-Pacific and the Americas**. The ITSI funding will be deployed to promote the expansion of the international assembly, testing, and packaging capacity needed to diversify the global semiconductor supply chain.
The United States will engage with like-minded partners to identify key regulatory and policy levers to attract semiconductor supply chain investments, identify workforce and infrastructure development needs, and engage in targeted capacity-building to help fill those gaps. This will also include ensuring countries have the necessary measures in place to safeguard leading-edge chips and technology from diversion and misuse.
* **Protecting National Security**. Some uses of advanced semiconductors can pose national security risks. The mechanisms to mitigate those risks – including collaboration with international partners on export controls and licensing policies – require strengthening.
The Department will facilitate the development and close coordination of such policies and practices with supply chain allies and partners.
## Secure Information and Communications Technology (ICT) Under the Digital Connectivity and Cybersecurity Partnership (DCCP), the U.S. government works with partners and allies around the world help countries harness the benefits of a vibrant digital ecosystem underpinned by secure and trustworthy ICT infrastructure and services. To advance these efforts, $40.
7 million in Fiscal Year 2023 ITSI funding will support the following efforts: * **Developing Enabling Environments for Secure ICT Ecosystems. ** The Department will provide capacity building training and technical advisory support to raise risk awareness and support the adoption of policy and regulatory frameworks that ensure trust and security are central decision-making factors across the ICT ecosystem.
Programs will also advance policies that promote telecommunications supplier diversity, including through the development and adoption of open and interoperable network architectures. In addition, funding will train and incubate the next generation of ICT and innovation leaders by connecting partners with U.S. universities and U.S. research institutions to build medium- to long-term capacity and create linkages with U.S. industry.
* **Deploying Secure ICT Infrastructure. ** Meaningful connectivity is critical to enabling countries to take advantage of the incredible economic and social opportunities afforded by a vibrant digital ecosystem. However, to realize these benefits it is critical that trustworthy vendors build and maintain connectivity infrastructure.
The Department, in collaboration with USAID, the U.S. Trade and Development Agency, the Export-Import Bank of the United States and U.S. International Development Finance Corporation, will provide financing, project preparation support, and other investment de-risking support to catalyze private sector investments in secure ICT networks.
In addition, this program will complement the Department of Commerce’s Public Wireless Innovation Fund by engaging with governments and the private sector to support pilot deployments of Open RAN networks to help demonstrate commercial viability. * **Defending Against Malicious Cyber Activity**.
To maintain healthy and thriving ICT ecosystems, nations need cybersecurity tools, technologies and national incident management capabilities to defend against, manage, respond to, and recover from cybersecurity threats to ICT infrastructure. The United States will engage with select partners to provide cybersecurity tools and services to better manage cybersecurity threats. ## Salaries, Oversight, and Related Expenses
Based on current listing details, eligibility includes: Partnerships with U.S. universities and U.S. research institutions are explicitly mentioned as a component. Applicants should confirm final requirements in the official notice before submission.
Current published award information indicates $500 million over five years ($100 million per year starting FY2023) Always verify allowable costs, matching requirements, and funding caps directly in the sponsor documentation.
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