1,000+ Opportunities
Find the right grant
Search federal, foundation, and corporate grants with AI — or browse by agency, topic, and state.
Topic was temporarily posted March 2, 2026, then removed pending SBIR program reauthorization. Expected to be released once reauthorized. The stored grant title says SBIR Phase I but the page describes it as STTR.
Navy SBIR Phase I - Develop Low-Cost, Lightweight, Flexible Printed Organic Thermoelectric Cooling Films is a Department of Defense Small Business Innovation Research (SBIR) contract opportunity seeking development of flexible thermoelectric cooling films using printed organic semiconductors.
The goal is to create lightweight, low-cost cooling films with a bending radius of less than one inch, suitable for cooling warfighters at small scale or military platform surfaces at larger scale. The films must conform to curved surfaces including wrists, ankles, and complex geometries. Awards of $240,000 are available for Phase I development.
Eligible applicants are for-profit, U.S.-owned and controlled companies with 500 or fewer employees, including affiliates. The application deadline is April 29, 2026.
Get alerted about grants like this
Get emailed when new opportunities from “Department of Defense” or related funders appear. Free, weekly, unsubscribe anytime.
Or search similar grants →Extracted from the official opportunity page/RFP to help you evaluate fit faster.
Flexible Printed Thermoelectric Cooling Film - STTR Topic DON26TZ01-NV013 — BW&CO Flexible Printed Thermoelectric Cooling Film - STTR Topic DON26TZ01-NV013 Active specific topic DSIP 2 This topic was temporarily posted by the Department of War SBIR Program on March 2nd 2026 and removed the following day.
We believe this topic is planned to be released once the SBIR program is reauthorized; however, this topic may ultimately be modified or withdrawn. Notify Me When This is Released Develop a low-cost and lightweight thermoelectric cooling film that could be used to cool the warfighter (small scale) or surfaces on military platforms (larger scale) using printed organic semiconductors.
The flexible cooling films should have a bending radius of less than one inch to easily wrap around pipes, wrists, and ankles, and be able to conform to complex curvatures on larger surfaces. Thermoelectric cooling devices based on narrow bandgap semiconductors such as bismuth telluride are commercially available.
They are solid state devices and thus do not have the large footprint and moving parts associated with vapor compression refrigeration systems; however, they operate with lower efficiency. They are well-suited for cooling small flat surfaces where one is more concerned with the form factor than efficiency.
For many practical applications, these square ceramic tile thermoelectric devices are heavy and too rigid, and do not offer conformal contact to curved surfaces. Over the past fifteen years, a lot of progress has been made on organic thermoelectric materials.
Though the thermoelectric figure of merit (ZT) has not caught up to that of bismuth telluride and other inorganic materials, the potential to make low-cost, lightweight, and flexible devices has opened a new application space for thermoelectric cooling where flexibility and large-area conformal contact are prioritized over efficiency.
For instance, lightweight headbands and wristbands only need to remove a small amount of heat to provide significant cooling sensation to the user. Likewise, there are diffuse, large surface area applications with similar cooling needs. Prior research was summarized in a recent review article by Segalman [Ref 1].
The conducting polymer Poly(3,4-ethylenedioxythiophene) [PEDOT] was identified as a strong candidate for the p-type leg in the p-n device, but device performance has been limited by the lack of suitable n-type materials. The organic electronics community has long wrestled with n-type materials due to potential oxidation of the electron carriers.
A number of inherently stable and high performing n-type polymers have recently been developed [Ref 2] that should complement the available p-type materials and enable significantly improved thermoelectric cooling device performance.
New device designs obtainable with simple fabrication must be developed to take advantage of the anisotropic thermal conductance and charge transport in these materials, which is typically maximized in-plane and along the polymer molecular backbones, such that measured thin film behaviors successfully translate into device performance.
A number of design and fabrication strategies have been demonstrated but much more innovation is possible [Ref 1]. It is an appropriate time to develop lightweight, flexible thermoelectric cooling devices for these niche applications. This STTR topic is for low-cost, lightweight, and flexible thermoelectrics for personal cooling as well as for large area applications.
The flexible cooling films should have a bending radius of less than one inch to easily wrap around pipes, wrists, and ankles, and be able to conform to complex curvatures on larger surfaces. The stated applications are near-ambient temperatures though the conjugated polymers should be able to handle temperatures up to 200°C. Composite approaches that are appropriate are welcome.
This topic is not soliciting a fabric-based solution. If you can achieve the objective above better than any other company on the market, you have a very high-likelihood of success and should apply. Who is eligible to apply?
Any company that meets the following criteria: U.S.-owned and controlled. 500 or fewer employees (including affiliates) 1) End-to-end support including, strategy, writing of the full proposal, and administrative & compliance support. 2) Proposal strategy and review.
3) Administrative & compliance support. Request to talk with a member of our team by completing the form below: Defense & Dual Use Technology NAVY Advanced Materials & Manufacturing Biotech healthtech Medtech https://www. bwcoconsulting.
com Test and Alert System for Type 1 Encryption Device Hold-up Batteries (HUB) - STTR Topic DON26BZ01-NV007 Domestic Production of Zirconium and Hafnium Metal Organic Precursors - SBIR Topic DON26BZ01-DV002
According to the current listing, eligibility includes: For-profit, U. S. -owned and controlled companies with 500 or fewer employees (including affiliates). Confirm the full requirements in the official notice before applying.
The current listing shows $240,000. Verify award ceilings, matching requirements, and allowable costs in the official notice.
The published deadline was April 29, 2026, which has passed. Check the official notice for any future application windows before investing time in a proposal.
Navy SBIR Phase I - Develop Low-Cost, Lightweight, Flexible Printed Organic Thermoelectric Cooling Films is funded by Department of Defense. Verify program details on the funder's official page before applying.
Yes — this listing is flagged as national in scope, so applicants across the U.S. may apply, subject to the sponsor's other eligibility criteria.
Applications go through the funder's official portal — the Apply Now link on this page goes there directly.
The Department of Defense FY2026 Defense University Research Instrumentation Program (DURIP) provides funding for U.S. universities to acquire research equipment and instrumentation in areas important to national defense, including AI and machine learning hardware. The program is administered jointly by the Army Research Office (ARO), Office of Naval Research (ONR), and Air Force Office of Scientific Research (AFOSR), with approximately $34 million available and 95 awards anticipated. DURIP funds the acquisition of specialized computing hardware for AI/ML research (GPU clusters, TPUs, neuromorphic processors), robotics and autonomous systems testbeds, sensor arrays and data collection systems for machine learning training, high-performance computing infrastructure for defense-relevant AI research, and laboratory equipment for human-AI interaction studies. The program specifically supports equipment that enhances research-related education in DoD-priority disciplines. While general-purpose computing is not eligible, computing equipment directly supporting DoD-relevant AI research programs qualifies. No cost sharing is required.
The FY2026 Department of Defense Multidisciplinary University Research Initiative (MURI) program supports basic research in science and engineering at U.S. institutions of higher education, with emphasis on multidisciplinary research where more than one traditional discipline interacts. The Army, Navy, and Air Force basic research offices are seeking applications across 22 topic areas including artificial intelligence and autonomy, information sensing and processing, and systems manipulation. MURI grants typically provide $1.25 million to $1.5 million per year for three years with option to extend two additional years. Approximately $170 million in total funding is available annually across all topics. The program is administered through the Office of Naval Research (ONR), Army Research Office (ARO), and Air Force Office of Scientific Research (AFOSR).
DoD Multidisciplinary Research Program of the University Research Initiative (MURI) is sponsored by Department of Defense (DoD) - Office of Naval Research (ONR). The Multidisciplinary Research Program of the University Research Initiative (MURI), administered by the Department of Defense Office of Naval Research, supports basic research in science and engineering at U. S.
DoD Multidisciplinary Research Program of the University Research Initiative (MURI) is sponsored by Department of Defense (DoD) - Office of Naval Research (ONR). The Multidisciplinary Research Program of the University Research Initiative (MURI), administered by the Department of Defense Office of Naval Research, supports basic research in science and engineering at U. S.
SBIR SF254-D1206: Knowledge-Guided Test and Evaluation Frameworks for proliferated Low Earth Orbit Constellations is sponsored by U.S. Air Force. DOD SBIR topic SF254-D1206: Knowledge-Guided Test and Evaluation Frameworks for proliferated Low Earth Orbit Constellations. Component: U.S. Air Force. Command: SDA. Solicitation: DoD SBIR 2025.4. Phase(s): D2PII, II, SPII. Status: Pre-Release. Open date: 3/4/2026.
The Department's FY26 SBIR/STTR Release 3 opened June 24 with roughly 37 topics across DARPA, the Navy, the Air Force, and the defense components, all closing July 22. The compressed four-week window is unforgiving, but the bigger mistake founders make is treating every component the same. Here is how to read the release, the eligibility rules that disqualify good companies, and why the component you target matters more than the topic you pick.
Read articleDoW's 2026 SBIR Broad Agency Announcement now operates on a monthly pre-release / quarterly close cadence. The 42 topics closing June 24 are the first test of whether the new rhythm produces the steady-state deal flow defense innovators have been asking for since 2022.
Read articleBioMADE just funded 14 projects spanning lithium extraction, AI-driven protein engineering, and veteran workforce programs. The first-ever NSF partnership changes how basic research reaches production.
Read article