Semiconductor Supply Chain Investments is sponsored by Department of Commerce. Supports investments in the semiconductor supply chain, including manufacturing and research.

Semiconductor Supply Chain Investments - Semiconductor Industry Association Semiconductor Supply Chain Investments America’s Chip Resurgence: Over $640 Billion in Semiconductor Supply Chain Investments Last updated January 30, 2026 The Advanced Manufacturing Investment Credit (Section 48D) and manufacturing grant incentives have sparked substantial investments in the U.S. In fact, companies in the semiconductor ecosystem have announced over 140 projects across 30 states —totaling more than $645.

3 billion dollars in private investments—since 2020. These announced projects will create and support over 525,000 American job s — 71,000 facility jobs in the semiconductor ecosystem; 122,000 construction jobs ; and support over 335,000 additional jobs throughout the U.S. economy. Thus far, the Department of Commerce has announced $33.

0787 billion in grant awards and up to $7. 15 billion in loans to 35 companies across 52 projects. A Preliminary memorandum of terms (PMTs) or letter of intent (LOI) is a non-binding agreement between companies and the Department of Commerce.

A due diligence stage follows a PMT or LOI, after which a final award agreement will be reached. As milestones of the projects are achieved, funds will be disbursed to reimburse awardees for funds spent to reach each milestone. The Departments of Defense and Commerce also issued a joint statement on Sept.

16, 2024 announcing Intel as the recipient of up to $3 billion in grant incentives for the “Secure Enclave” program, which “will support the manufacturing of microelectronics and ensure access to a domestic supply chain of advanced semiconductors for national security.

” SIA looks forward to working with the Treasury and Commerce Departments to ensure tax credit and grant incentives are implemented in an effective, efficient, and timely manner. Doing so will help reinvigorate U.S. chip production and innovation and deliver major benefits for America’s economy, job creation, national security, supply chain resilience, and technology leadership.

SIA will update this webpage with announcements regarding investments in commercial fabrication facilities (front-end and back-end), facilities for the manufacturing of semiconductor equipment and materials, and R&D facilities.

Incentive Amount: $50 million Project Type: New Facility Technology: Rare Earth Magnets Additional Information: “The planned incentives are for the purchase of equipment for the production of domestic Neodymium Iron Boron (NdFeB) magnets which will significantly bolster U.S. critical minerals supply chains. The Department of Commerce will receive $50 million of equity in Vulcan Elements. ” Date of PMT: Jan.

16, 2025 Incentive Amount: $105 million across 3 locations Project Type: Expansion, Modernization Technology: 180nm and 350nm analog Additional Information: “CHIPS for America’s proposed investment in Oregon would support the expansion of front-end mature node semiconductor manufacturing for devices used in a wide variety of applications, including but not limited to automotive, industrial, and defense applications. ” Date of PMT: Jan.

16, 2025 Incentive Amount: $105 million across 3 locations Project Type: Expansion, Modernization Technology: 180nm and 350nm analog Additional Information: “CHIPS for America’s proposed investment in Washington would support the expansion of front-end mature node semiconductor manufacturing for devices used in a wide variety of applications, including but not limited to automotive, industrial, and defense applications.

” Date of PMT: Jan. 16, 2025 Incentive Amount: $105 million across 3 locations Project Type: Expansion, Modernization Technology: RF microwave systems; packaging and test Additional Information: “The proposed investment in ADI would support the expansion and modernization of two advanced research & development (R&D) and Radio Frequency (RF) Microwave (MW) systems manufacturing facilities in Chelmsford, Massachusetts. ” Date of PMT: Jan.

16, 2025 Incentive Amount: $79 million Project Type: Expansion, Modernization Technology: 150mm and 200mm SiC substrates Additional Information: “The proposed CHIPS investment would also support the expansion of the facility’s SiC epitaxial wafer manufacturing capacity, back-end of line processing, electronic performance, and reliability testing capabilities.

SiC substrates are an important bandgap material with end uses in energy and military applications. ” Date of PMT: Jan. 16, 2025 Sumika (Sumitomo Chemical) Incentive Amount: $52.

1 million Technology: Ultra-high purity isopropyl alcohol Additional Information: “The proposed CHIPS funding would support the manufacturing of ultra-high purity (UHP) isopropyl alcohol (IPA) used in advanced logic and memory chip production. ” Date of PMT: Jan. 16, 2025 Incentive Amount: $10.

3 million Project Type: Expansion, Modernization Technology: Compound wafers (InP, GaAs, GaSb, GaN) Additional Information: “The proposed CHIPS funding would support IntelliEPI’s growth of high-quality epitaxy material on Indium Phosphide (“InP”), Gallium Arsenide (“GaAs”), Gallium Antimonide (“GaSb”), and Gallium Nitride (“GaN”) compound semiconductor wafers based on an advanced production Molecular Beam Epitaxy (MBE) technology platform.

” Date of PMT: Jan.

16, 2025 Location: Morrisville, NC Incentive Amount: $70 million across 2 locations Project Type: Expansion, Modernization Technology: 100mm GaN & GaAs; 150mm GaN Additional Information: “The proposed CHIPS funding would support the expansion and modernization of MACOM’s existing facility which would increase the production of 100mm Gallium Nitride (GaN) and Gallium Arsenide (GaAs) semiconductor fabrication and introduce the production of 150mm GaN.

” Date of PMT: Jan.

14, 2025 Incentive Amount: $70 million across 2 locations Project Type: Expansion, Modernization Technology: 100mm GaN & GaAs; 150mm GaN Additional Information: “The proposed CHIPS funding would support the expansion and modernization of MACOM’s existing facility which would increase the production of 100mm Gallium Nitride (GaN) and Gallium Arsenide (GaAs) semiconductor fabrication and introduce the production of 150mm GaN.

” Date of PMT: Jan. 14, 2025 Incentive Amount: $225 million Project Type: Expansion, Modernization Technology: 200mm Silicon Carbide – front-end and back-end Additional Information: “This proposed CHIPS investment would support the expansion of Bosch’s largest SiC device factory globally and increase the company’s production capacity which could comprise more than 40% of all U.S.-based SiC device manufacturing capacity.

Bosch expects to produce its first chips on 200-millimeter wafers in its Roseville facility starting in 2026.

The facility will perform both front-end device manufacturing and backend testing, sorting, and dicing processes” Incentive Amount: $275 million Project Type: Modernization Technology: Legacy DRAM, 1-alpha node technology Additional Information: “The Department of Commerce has signed a non-binding Preliminary Memorandum of Terms (PMT) with Micron Technology for up to $275 million in proposed funding to expand and modernize its facility in Manassas, Virginia.

The expected capital expenditure for the modernization will be $2 billion over the next several years. The proposed project would onshore Micron’s 1-alpha technology to its Manassas facility, significantly increasing monthly wafer output. Micron’s 1-alpha node, an advanced DRAM process technology, offers meaningful improvements in bit density, power efficiency, and performance capability.

Supporting a stable supply of Micron’s 1-alpha technology would advance U.S. supply chain resiliency because the legacy DRAM memory chips that would be made in Virginia are important components for the automotive and industrial markets. Micron’s proposed project in Manassas would be expected to create over 400 manufacturing jobs and up to 2700 community jobs at the peak of the project.

” Location: Bloomington, MN Incentive Amount: $16 million Project Type: Modernization Technology: 90nm and 130nm foundry Additional Information: “The Biden-Harris Administration’s proposed investment of up to $16 million in SkyWater would support the modernization of its existing facility in Bloomington, Minnesota to improve the quality of production and wafer services by replacing equipment, upgrading the facility’s cleanroom and space and IT systems, and increase overall production capacity of 90nm and 130nm wafers by approximately 30%.

SkyWater’s Bloomington facility offers its customers in the aerospace and defense, automotive, biomedical and industrial markets the ability to prototype and scale to volume production differentiated technology.

The company is a Department of Defense (DoD) Trusted Foundry; as a result of proposed CHIPS funding, the company would be able to improve productivity and enhance operational sustainability to support DoD missions as well as grow its commercial business.

” Incentive Amount: $33 million Project Type: Expansion/Modernization Technology: 150mm Indium Phosphide Optoelectronics Additional Information: “The Biden-Harris Administration’s proposed investment of up to $33 million would support the modernization and expansion of a state-of-the-art manufacturing cleanroom in Coherent’s existing 700,000 square-foot facility in Sherman, Texas to establish the world’s first 150mm indium phosphide (InP) manufacturing line by adding advanced wafer fabrication equipment to produce InP devices at scale.

InP optoelectronic devices are widely used in applications such as datacom and telecom transceivers, including for AI infrastructure applications, advanced sensing for consumer electronics, and medical and automotive applications.

The increased production of Coherent’s InP devices, which are increasingly growing in demand, would allow the U.S. to advance supply chain resiliency and technological leadership and create approximately 70 jobs.

” Incentive Amount: $50 million Project Type: Expansion/Modernization Technology: Silicon carbide foundry Additional Information: “The Biden-Harris Administration’s proposed investment of up to $50 million would support the expansion and modernization of X-Fab’s Silicon Carbide (SiC) foundry facility, the only high-volume SiC foundry in the U.S. SiC technology is key to the global decarbonization efforts in the automotive and industrial sectors and offers multiple advantages over conventional silicon-based technologies for high-power applications.

The proposed CHIPS funding would bolster supply resiliency for critical infrastructure markets that were adversely impacted by foundry capacity shortages and supply chain disruptions during the COVID-19 pandemic. ” Location: West Oakland, CA Incentive Amount: $18.

2 million Technology: Diamond Cooling substrates, devices, and systems Additional Information: “The proposed CHIPS investment would support the construction of a 40,000 square foot cleanroom space within an existing building to transform it into a facility for semiconductor manufacturing with various Diamond Cooling substrates, devices, and systems at scale.

The funding would support a $121 million investment by Akash and enable the company to leverage its intellectual property and experience of developing semiconductor technologies that serve important end markets such as communications and the defense industrial base.

” Incentive Amount: $32 million Technology: High Purity Fused Silica and Extreme Ultra Low Expansion Glass Additional Information: “[This project will] increase production of Corning HPFS Fused Silica (High Purity Fused Silica) (HPFS) and EXTREME ULE Glass (Ultra Low Expansion Glass) and scale a novel technology manufacturing process in Canton.

HFPS and ULE materials are key components of deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography machines and photomasks, which are important for the manufacturing of leading-edge semiconductors, and this new technology would improve EUV performance with a lower carbon footprint.

This proposed investment in Corning would help enable a reliable domestic supply of these important components in the United States and help advance U.S. technology leadership in the lithography supply chain.

” Incentive Amount: $3 million Project Type: Modernization, Expansion Technology: Power module packaging Additional Information: “This facility packages semiconductor power modules for important defense applications including the F-35, as well as commercial and industrial applications. The proposed funding would be expected to nearly double capacity and modernize key equipment.

The project is estimated to create over 55 manufacturing jobs and up to 20 construction jobs.

” Incentive Amount: $325 million Project Type: New Facility Technology: Hyper-pure semiconductor-grade polysilicon Additional Information: “The CHIPS for America award will provide Hemlock Semiconductor up to $325 million in total direct funding under the CHIPS and Science Act to support the construction of a new manufacturing facility on HSC’s existing campus in Hemlock, Michigan, dedicated to the production and purification of hyper-pure semiconductor-grade polysilicon.

” Date of PMT: Oct. 21, 2024 Final Award: Jan. 7, 2025 Incentive Amount: $93 million across both projects Project Type: New Facility Technology: Assembly Test and Packaging Additional Information: “Construct a new, state-of-the-art advanced test and packaging facility focused on meeting the increasing demand for InP PICs.

As one of the only advanced test and packaging facilities dedicated to packaging InP PICs in the United States, this project would also help bolster the domestic and global packaging supply chains while keeping a domestic packaging base for Infinera’s defense and intelligence customers and the commercial and AI sectors.

Additionally, this facility would include dedicated R&D space focused on newer optical packaging technologies, such as 2. 5D and 3D packaging and co-packaged optics. ” Date of Final Award: Jan.

17, 2025 Incentive Amount: $93 million across both projects Technology: Indium Phosphide Photonics Additional Information: “Construct a new, modernized fab and foundry with over 40,000 square feet of cleanroom space to increase its InP PIC manufacturing to meet future capacity and capability demands.

The projects would allow Infinera to increase the domestic fabrication and advanced test and packaging of InP PICs for the Department of Defense, Intelligence Community, law enforcement, and national security agencies for secure communications and emerging technologies such as quantum technology, sensing, and LiDAR. ” Date of Final Award: Jan.

17, 2025 Incentive Amount: $750 million across both projects Technology: Silicon Carbide Additional Information: “The proposed funding would support the construction of a new silicon carbide wafer manufacturing facility in Siler City, North Carolina, helping to secure a reliable domestic supply of the semiconductors that will underpin the future energy economy and AI boom.

This new, 2-million-square-foot facility would become the United States’ largest silicon carbide wafer manufacturing facility and the world’s first high-volume 200mm silicon carbide wafer manufacturing facility.

” Incentive Amount: $750 million across both projects Project Type: Fab expansion Technology: Silicon Carbide Additional Information: “The proposed investment would contribute to the growth of the manufacturing facility as the world’s first fully automated 200mm silicon carbide power device fab and increase its production capacity by approximately 30%. This fab is qualified to serve both automotive and industrial and energy customers.

” Incentive Amount: $18 million Project Type: New Facility Technology: Equipment – dry vacuum pumps Additional Information: “This proposed funding would support the construction of a greenfield state-of-the-art manufacturing facility in Genesee County, New York, which the company first announced in 2022.

The facility will produce the dry vacuum pumps, which are needed for semiconductor production, and is estimated to create approximately 600 good-paying jobs. Currently, there is no domestic production of semiconductor-grade dry vacuum pumps.

These pumps are essential for both advanced and legacy semiconductor fabrication: Installed beneath the fab, they maintain the chamber environment where wafers are processed by evacuating toxic fumes and chemicals.

” Incentive Amount: $50 million Project Type: Expansion, Modernization Additional Information: “The CHIPS for America award will provide HP up to $53 million in total direct funding under the CHIPS and Science Act to support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from research and development (“R&D”) activities to commercial manufacturing operations.

” Date of PMT: Aug. 27, 2024 Date of Final Award: Jan. 13, 2025 Incentive Amount: $900 million Project Size: $18 billion across 2 locations Technology: Current generation and mature-node Additional Information: “ Construction of two new, large-scale 300-mm fabrication facilities that are expected to produce 65nm – 130nm essential chips, with anticipated production capacity of more than one hundred million chips every day.

The Sherman site is one of the only greenfield production sites for chips on 300-mm wafers in the U.S. ” Date of Final Award: Dec.

20 Incentive Amount: $700 million Project Size: $18 billion across 2 locations Technology: Current generation and mature-node Additional Information: “ Construction of a new, large-scale 300-mm fabrication facility to produce 28nm – 65nm analog and embedded processing chips, which is anticipated to produce tens of millions of chips every day. This project represents the largest economic investment in Utah’s history.

” Date of Final Award: Dec. 20 Location: West Lafayette, IN Incentive Amount: $458 million in grants, $500 million in loans Project Size: $3.

87 billion Project Type: New Facility Technology: Advanced Packaging and R&D Additional Information: “The proposed CHIPS investment would support SK’s West Lafayette facility at the Purdue University Research Park, which will be home to an advanced semiconductor packaging line that will mass-produce next generation HBM, the highest performance memory chips, that are crucial components of Graphics Processing Units (GPUs) that train AI systems.

Mass production at the facility is expected to begin in the second half of 2028. SK hynix will collaborate with Purdue University on plans for future R&D projects, which include working on advanced packaging and heterogenous integration with Purdue’s Birck Nanotechnology Center and other research and institutes and industry partners.

The next generation HBM that will be researched and developed, and mass-produced, and packaged in this ecosystem with Purdue University will play an important role in the U.S. semiconductor ecosystem and advancing U.S. technological leadership. ” Incentive Amount: $400 million Project Size: $1.

7 billion Project Type: New Facility Technology: Advanced Packaging and Test Additional Information: “This proposed funding would support Amkor’s investment of approximately $2 billion and 2,000 jobs in a greenfield project in Peoria, Arizona, which will provide full end-to-end advanced packaging for the world’s most advanced semiconductors for applications in high-performance computing, artificial intelligence, communications, and automotive, end markets.

Amkor’s use of 2. 5D technology is foundational for meeting the rapidly increasing demand for generative AI products and services as it is the final step in the manufacturing of graphic processing units (“GPUs”) for high-performance computing applications and other AI chips.

When fully operational, Amkor will package and test millions of leading-edge chips serving autonomous vehicles, 5G/6G smartphones, and large-scale datacenters across a range of customers. ” Date of Final Award: Dec.

20 Incentive Amount: $380 million Project Size: $4 billion across all projects Project Type: New Facility, Expansion Additional Information: “Establish the first 300mm silicon wafer manufacturing facility for advanced chips in the United States. Of note, 300mm silicon wafers are a key input used by foundries and integrated device manufacturers to manufacture leading-edge, mature-node, and memory chips.

[…] GlobalWafers plans to convert a portion of its existing silicon epitaxy wafer manufacturing facility in Sherman, Texas to silicon carbide (“SiC”) epitaxy wafer manufacturing, producing 150mm and 200mm SiC epitaxy wafers. SiC epitaxy wafers are a critical component for high-voltage applications, notably including electric vehicles and clean energy infrastructure.

” Incentive Amount: $20 million Project Size: $4 billion across all projects Project Type: New Facility Additional Information: “Establish a new facility to produce 300mm silicon-on-insulator (“SOI”) wafers. Importantly, SOI wafers allow for significantly improved performance in harsh environments and are commonly used in defense and aerospace end uses. ” Rogue Valley Microdevices Incentive Amount: $6.

7 million Project Size: $25 million Project Type: New Facility Technology: MEMS (mature-node) Additional Information: “The proposed CHIPS investment would support the construction of RVM’s pure play microelectromechanical systems (MEMS) and sensor foundry facility in Palm Bay, Florida, and is estimated to nearly triple RVM’s manufacturing capacity.

MEMS are microscale devices that integrate electrical and mechanical components; their integration with semiconductor components across a wide range of applications enables technology advancements and improved performance.

RVM is one of the only U.S.-based pure play MEMS foundries which specializes in the high-mix, low-volume wafer and MEMS foundry services that are important to the defense industrial base and to the biomedical industry.

With this proposed investment, the Biden-Harris Administration would be supporting a reliable, domestic supply of MEMS devices manufactured on 300mm wafers, further strengthening U.S. supply chain resilience while creating over 75 jobs in the state of Florida.

” Location: Colorado Springs, CO Incentive Amount: $77 million Project Size: $722 million Project Type: New Facility Technology: Equipment and Materials Additional Information: “The proposed CHIPS investment would support Entegris’ construction of its state-of-the-art manufacturing center in Colorado Springs.

The center is being built in multiple phases: the first to support production of FOUPs—which are currently entirely produced abroad—and liquid filter membranes, and the second phase to support the production of advanced liquid filters and purifiers as well as fluid handling solutions. Entegris is a leading supplier of advanced materials and process solutions for the semiconductor and other high-technology industries.

Notably, the company invented the Front Opening Unified Pods (FOUPs), which are the highly specialized containers that secure semiconductor wafers while they are handled and transported during the manufacturing process. The proposed investment would create nearly 600 direct manufacturing jobs over a period of several years and approximately 500 construction jobs by 2030.

” Date of Final Award : December 5 Location: Albuquerque, NM Incentive Amount: $23. 9 million Project Size: Not Available Project Type: Modernization, Expansion Additional Information: “The proposed CHIPS investment would help create a more robust and resilient supply of space-grade solar cells that power spacecrafts and satellites.

The modernization and expansion project would increase Rocket Lab’s compound semiconductor production by 50% within the next three years – helping to meet the growing national security and commercial demand for these solar cells in the United States.

Rocket Lab is one of two companies in the United States that specialize in the production of highly efficient and radiation resistant compound semiconductors called space-grade solar cells – devices used in space to convert light to electricity. The proposed investment would create over 100 direct manufacturing jobs. ” Date of Final Award : Nov.

25 Incentive Amount: $75 million Project Size: $343 million Project Type: New Facility Technology: Materials for Advanced Packaging Additional Information: “The proposed CHIPS investment would support the construction of a 120,000 square-foot facility in Covington, Georgia and the development of substrates technology for use in semiconductor advanced packaging.

Absolics glass substrates will be used as an important advanced packaging technology to increase the performance of leading-edge chips for AI, high-performance compute and data centers by reducing power consumption and system complexity. The glass substrates produced by Absolics enable smaller, more densely packed, and shorter length connections resulting in faster and more energy efficient computing.

This proposed investment would support over an estimated 1,000 construction jobs and approximately 200 manufacturing and R&D jobs in Covington and enhance innovation capacity at Georgia Institute of Technology (Georgia Tech), supporting the local semiconductor talent pipeline.

” Date of Final Award : December 5 Location: Bloomington, MN Incentive Amount: $123 million Project Size: $525 million Project Type: Expansion, Modernization Additional Information: “This proposed funding would catalyze investment from private and state sources to expand Polar’s manufacturing facility and introduce new technology capabilities in Bloomington, Minnesota.

The expansion and modernization would enable Polar to double its U.S. production capacity of sensor and power chips within two years. Additionally, this proposed investment would bring in more U.S. private capital, which would transform Polar from a majority foreign-owned in-house manufacturer to a majority U.S.-owned commercial foundry, expanding opportunities for U.S. chip designers to innovate and produce technologies domestically.

” Date of Final Award: Sept. 24 Incentive Amount: $4. 6 billion Project Size: $100 billion Technology: Leading-edge DRAM Additional Information: “Construct first two fabs of planned four fab “megafab” focused on leading-edge DRAM chip production.

Each fab will have 600,000 square feet of cleanrooms, totaling 2. 4 million square feet of cleanroom space across the four facilities—the largest amount of cleanroom space ever announced in the United States and the size of nearly 40 football fields. ” Date of Final Award : Dec.

10 Incentive Amount: $1. 5 billion Project Size: $25 billion Technology: Leading-edge DRAM Additional Information: “Develop a high-volume manufacturing (HVM) fab, with approximately 600,000 square feet of cleanroom space focused on the production of leading-edge DRAM chips.

The fab would be co-located with the company’s R&D facility to improve efficiency across their R&D and manufacturing operations, reducing lags in technology transfer and cutting time-to-market for leading-edge memory products. ” Date of Final Award : Dec. 10 Incentive Amount: Across all Samsung projects, $6.

4 billion in grants Project Size: $45 billion across all projects Project Type: 2 new logic fabs, 1 new R&D fab Technology: Leading-edge, advanced packaging Additional Information: “Construct a comprehensive advanced manufacturing ecosystem, ranging from leading-edge logic to advanced packaging to R&D, transforming the small municipality of Taylor into an expansive hub of leading-edge semiconductor manufacturing.

This ecosystem would include two leading-edge logic foundry fabs focused on mass production of 4nm and 2nm process technologies, an R&D fab dedicated to development and research on technology generations ahead of nodes currently in production, and an advanced packaging facility producing 3D High Bandwidth Memory and 2. 5D packaging, both of which have critical artificial intelligence applications.

The semiconductors that are designed and manufactured in this ecosystem would serve a wide variety of end markets – from communications, automotive, and defense industries to high-performance computing and artificial intelligence. ” Date of Final Award : Dec. 20 Incentive Amount: $4.

745 billion across 2 locations Project Size: $37 billion across 2 locations Project Type: Facility expansion Additional Information: “Expand a facility that has been an economic engine for Central Texas for nearly 30 years.

This proposed investment would expand the existing facilities to support the production of leading fully depleted silicon-on-insulator (FD-SOI) process technologies for critical U.S. industries, including aerospace, defense, and automotive. This proposed investment also includes commitments to collaborate with the U.S. Department of Defense. ” Date of Final Award : Dec.

20 Incentive Amount: $6.

6 billion in grants, $5 billion in loans Project Size: $65 billion Additional Information: “In Arizona, TSMC’s three fabs are expected to bring a suite of the most advanced process node technologies to the United States: the first fab will produce 4nm FinFET process technologies; today, TSMC Arizona announced that the second fab will produce the world’s most advanced 2nm nanosheet process technology, in addition to previously announced plans to produce 3nm process technologies; and TSMC Arizona’s third fab will produce 2nm or more advanced process technologies depending on customer demand.

At full capacity, TSMC Arizona’s three fabs would manufacture tens of millions of leading-edge chips that will power products like 5G/6G smartphones, autonomous vehicles, and AI datacenter servers. TSMC Arizona expects to begin high-volume production in their first fab in the U.S. by the first half of 2025. ” Date of Final Award: Nov.

15 Incentive Amount: $3.

94 billion Project Size: $32 billion Project Type: 2 new fabs, 1 modernization Additional Information: “The CHIPS for America award will support the construction of two new leading-edge logic fabs and modernization of one existing fab, significantly increasing leading-edge logic capacity, including high volume domestic production of Intel 18A – the company’s most advanced chip design that enables higher performing, leading-edge chips through RibbonFET gate-all-around transistors and PowerVia backside power delivery.

” Date of Final Award: Nov. 26 Incentive Amount: $1. 5 billion Project Size: $28 billion Additional Information: “The CHIPS for America award will support the creation of a new regional chipmaking ecosystem, anchored by a new leading-edge logic fab which will produce the Intel 14A node and other future Intel nodes and expand leading-edge foundry capacity.

” Date of Final Award: Nov. 26 Incentive Amount: $500 million Project Type: 2 modernizations Technology: Advanced Packaging Additional Information: “The CHIPS for America award will support the modernization of two existing fabs into an advanced packaging facility to close an important gap in the domestic semiconductor supply chain. ” Date of Final Award: Nov.

26 Incentive Amount: $1.

86 billion Project Size: $36 billion Project Type: Modernization, Expansion Technology: R&D, leading-edge Additional Information: “The CHIPS for America award will support the investment in the premier hub of leading-edge research and development in the United States through the expansion and modernization of technology development facilities that will utilize the world’s first commercial High-NA EUV lithography equipment.

” Date of Final Award: Nov. 26 Incentive Amount: $1. 45 billion Project Size: $13.

1 billion Project Type: New facility and facility expansion Technology: Current-generation, mature-node Additional Information: “The construction of a new, large-scale 300 mm fabrication facility that is expected to produce high value technologies not currently available in the U.S. The new facility is intended to leverage existing infrastructure to expedite the path from construction to production.

The proposed expansion of the existing Malta, New York fabrication facility, which includes a strategic agreement with General Motors, to secure a dedicated supply of essential semiconductor technologies. This project would also support America’s economic and national security by expanding domestic capacity for semiconductors that are used in the U.S. critical infrastructure base.

This expansion, combined with the new 300 mm fabrication facility, is expected to triple the existing capacity of the Malta campus over the next 10+ years. These two projects are expected to increase wafer production to 1 million per year once all phases are complete. ” Date of Final Award: Nov.

20 Location: Essex Junction, VT Incentive Amount: $125 million Project Size: $900 million Project Type: Revitalization Additional Information: “The revitalization of an existing fabrication facility in Burlington, Vermont, to commercialize new 200 mm technologies, creating the first U.S. facility capable of high-volume manufacturing of next-generation Gallium Nitride on Silicon for use in electric vehicles, power grid, 5G and 6G smartphones, and other critical technologies.

The site will apply industry-leading sustainability practices, including the use of 100% carbon-neutral energy and the development of an onsite solar system to supply up to 9% of the site’s annual energy. ” Date of Final Award: Nov.

20 Location: Colorado Springs, CO Incentive Amount: $90 million Project Type: Modernization and Expansion Additional Information: Alongside an award to Microchip’s facility in Gresham, OR, “this investment would enable Microchip to significantly increase its U.S. production of microcontroller units (MCUs) and other specialty semiconductors built on mature-nodes critical to America’s automotive, commercial, industrial, defense, and aerospace industries and create over 700 direct construction and manufacturing jobs.

The projects are estimated to nearly triple the share of semiconductors the company produces at these sites, decreasing its reliance on foreign foundries and strengthening supply chain resilience.

” Incentive Amount: $72 million Project Type: Modernization Additional Information: Alongside an award to Microchip’s facility in Colorado Springs, CO, “this investment would enable Microchip to significantly increase its U.S. production of microcontroller units (MCUs) and other specialty semiconductors built on mature-nodes critical to America’s automotive, commercial, industrial, defense, and aerospace industries and create over 700 direct construction and manufacturing jobs.

The projects are estimated to nearly triple the share of semiconductors the company produces at these sites, decreasing its reliance on foreign foundries and strengthening supply chain resilience. ” Incentive Amount: $35 million Project Type: Modernization Additional Information: “These incentives will support the modernization of the company’s Microelectronics Center, a mature-node facility in Nashua, New Hampshire.

This modernization project will replace aging tools and quadruple the production of chips necessary for critical defense programs, including the $1. 7 trillion F-35 fighter jet program. ” Date of PMT: Dec.

11, 2023 Date of Final Award: Nov. 25, 2024 1101 K Street NW Suite 450, Washington, DC 20005