Europe's First Chips Act Pilot Line Opens for Business in Grenoble
March 16, 2026 · 2 min read
Arthur Griffin
Europe's bid for semiconductor sovereignty just moved from blueprint to factory floor. The FAMES pilot line at CEA-Leti in Grenoble, backed by €830 million from the European Commission and eight member states, is now fully operational — the first of five planned Chips Act pilot lines to reach this milestone.
The facility focuses on Fully Depleted Silicon-on-Insulator (FD-SOI) technology, a chip manufacturing process that produces semiconductors consuming 30-40% less power than conventional designs at equivalent performance. For researchers and companies developing low-power AI chips, IoT sensors, and edge computing devices, FAMES provides something that previously required relationships with major foundries: near-industrial-scale fabrication and testing capabilities.
Open Access Changes the Game
The critical detail is the access model. FAMES operates as a shared facility where companies, startups, and research institutions can test new chip designs, equipment, and manufacturing processes without building their own fab. The consortium spans 11 institutions across France, Belgium, Germany, Ireland, Finland, Poland, Austria, and Spain — led by CEA-Leti with partners including imec, Fraunhofer, and Tyndall.
This open-call structure is specifically designed to lower barriers for small and mid-sized companies that can't afford the billions required for proprietary fabrication infrastructure.
What International Researchers Should Know
While FAMES is a European initiative, the EU Chips Act framework encourages international research collaboration. Academic teams with chip design expertise who need access to advanced FD-SOI prototyping should explore partnership opportunities through the consortium members.
The facility's launch also signals where the next wave of European semiconductor funding is heading. Four more Chips Act pilot lines are in development, covering other process technologies. Researchers positioned at the intersection of low-power design and AI acceleration are particularly well-aligned with FAMES's capabilities.
For those tracking international semiconductor and technology funding opportunities, grantedai.com monitors these programs alongside domestic grant opportunities.
In-depth analysis of this story and its implications for grant seekers is available on the Granted blog.