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CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology.
The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for semiconductor advanced packaging.
The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals relevant to one or more of five R&D areas: Equipment, Tools, Processes, and Process Integration; Power Delivery and Thermal Management; Connector Technology, Including Photonics and Radio Frequency (RF); Chiplets Ecosystem; and Co-design/Electronic Design Automation (EDA).
In addition to the R&D areas, the NOFO is expected to include a specific opportunity for prototype development in exemplar application areas such as high-performance computing and low-power systems needed for AI. Action: Notice of intent (NOI). Published in the Federal Register on 2024-07-09.
Federal Register document number: 2024-14980.
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CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology. The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. CHIPS R&D anticipates making available up to approximately $300,000,000 for multiple awards in amounts up to approximately $100,000,000 per award, not including voluntary co- investment, over up to 5 years and made through cooperative agreements or other transactions. The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals. Action: Notice of Intent (NOI). Published in the Federal Register on 2024-02-01. Federal Register document number: 2024-02026.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology. The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. CHIPS R&D anticipates making available up to approximately $300,000,000 for multiple awards in amounts up to approximately $100,000,000 per award, not including voluntary co- investment, over up to 5 years and made through cooperative agreements or other transactions. The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals. Action: Notice of Intent (NOI). Published in the Federal Register on 2024-02-01. Federal Register document number: 2024-02026.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology. The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for semiconductor advanced packaging. The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals relevant to one or more of five R&D areas: Equipment, Tools, Processes, and Process Integration; Power Delivery and Thermal Management; Connector Technology, Including Photonics and Radio Frequency (RF); Chiplets Ecosystem; and Co-design/Electronic Design Automation (EDA). In addition to the R&D areas, the NOFO is expected to include a specific opportunity for prototype development in exemplar application areas such as high-performance computing and low-power systems needed for AI. Action: Notice of intent (NOI). Published in the Federal Register on 2024-07-09. Federal Register document number: 2024-14980.
Small Business Innovation Research Program (SBIR) Phase II is sponsored by Administration for Community Living. Small Business Innovation Research Program (SBIR) Phase II is a forecasted funding opportunity on Grants.gov from Administration for Community Living. Fiscal Year: 2026. Assistance Listing Number(s): 93.433. <p>The purpose of the Federal SBIR program is to stimulate technological innovation in the private sector, strengthen the role of small business in meeting Federal research or research and development (R/R&D) needs, and improve the return on investment from Federally-funded research for economic and social benefits to the nation. The specific purpose of NIDILRR's SBIR program is to improve the lives of people with disabilities through R/R&D products generated by small businesses, and to ...
The J.M.K. Innovation Prize is a grant from The J.M. Kaplan Fund recognizing early-stage social entrepreneurs working on environmental, heritage, and social justice challenges. The prize rewards individuals and organizations demonstrating innovative, entrepreneurial approaches to enduring problems. Applications for the 2025 prize were accepted February 11 through April 25, 2025 via an online portal. Spanish-language applications are welcomed, and a Spanish application form is available for download. The prize is biennial and open to a broad range of applicants across the United States working on forward-thinking solutions at the intersection of environment, community, and cultural heritage.