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CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology.
The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors.
CHIPS R&D anticipates making available up to approximately $300,000,000 for multiple awards in amounts up to approximately $100,000,000 per award, not including voluntary co- investment, over up to 5 years and made through cooperative agreements or other transactions.
The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals. Action: Notice of Intent (NOI). Published in the Federal Register on 2024-02-01.
Federal Register document number: 2024-02026.
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CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology. The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for semiconductor advanced packaging. The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals relevant to one or more of five R&D areas: Equipment, Tools, Processes, and Process Integration; Power Delivery and Thermal Management; Connector Technology, Including Photonics and Radio Frequency (RF); Chiplets Ecosystem; and Co-design/Electronic Design Automation (EDA). In addition to the R&D areas, the NOFO is expected to include a specific opportunity for prototype development in exemplar application areas such as high-performance computing and low-power systems needed for AI. Action: Notice of intent (NOI). Published in the Federal Register on 2024-07-09. Federal Register document number: 2024-14980.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology. The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. CHIPS R&D anticipates making available up to approximately $300,000,000 for multiple awards in amounts up to approximately $100,000,000 per award, not including voluntary co- investment, over up to 5 years and made through cooperative agreements or other transactions. The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals. Action: Notice of Intent (NOI). Published in the Federal Register on 2024-02-01. Federal Register document number: 2024-02026.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology. The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for semiconductor advanced packaging. The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals relevant to one or more of five R&D areas: Equipment, Tools, Processes, and Process Integration; Power Delivery and Thermal Management; Connector Technology, Including Photonics and Radio Frequency (RF); Chiplets Ecosystem; and Co-design/Electronic Design Automation (EDA). In addition to the R&D areas, the NOFO is expected to include a specific opportunity for prototype development in exemplar application areas such as high-performance computing and low-power systems needed for AI. Action: Notice of intent (NOI). Published in the Federal Register on 2024-07-09. Federal Register document number: 2024-14980.
Research on Circular Economy, Smart Manufacturing, and Energy-Efficient Microelectronics is sponsored by U.S. Department of Energy (DOE) Advanced Materials & Manufacturing Technologies Office (AMMTO). This funding opportunity supports innovative technology R&D across the manufacturing sector with a focus on circular economy, smart manufacturing, and energy-efficient microelectronics. While the stated deadline for full applications has passed, AMMTO frequently issues similar solicitations, and this highlights a relevant area of interest for the DOE.
AWS Imagine Grant program - Momentum to Modernize Award is sponsored by Amazon Web Services (AWS). This award provides funding for transformational infrastructure projects, helping nonprofit organizations enhance their core mission operations with technology. This includes foundational technology projects, such as migrating servers to the cloud and modernizing new and existing applications.
NIST AI-Focused Manufacturing USA Institute is sponsored by National Institute of Standards and Technology (NIST). NIST announced an open competition for a new Manufacturing USA institute focused on the use of artificial intelligence (AI) to increase the resilience of U.S. manufacturers. The institute will be required to obtain cost-share funds from nonfederal sources.