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CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology.
The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for semiconductor advanced packaging.
The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals relevant to one or more of five R&D areas: Equipment, Tools, Processes, and Process Integration; Power Delivery and Thermal Management; Connector Technology, Including Photonics and Radio Frequency (RF); Chiplets Ecosystem; and Co-design/Electronic Design Automation (EDA).
In addition to the R&D areas, the NOFO is expected to include a specific opportunity for prototype development in exemplar application areas such as high-performance computing and low-power systems needed for AI. Action: Notice of intent (NOI). Published in the Federal Register on 2024-07-09.
Federal Register document number: 2024-14980.
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Yes — CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development is offered by Commerce Department; National Institute of Standards and Technology and this listing comes from Federal Register, an official U.S. federal source. Federal applications generally require registrations (for example SAM.gov or an agency submission portal), so allow extra lead time.
Start from the official opportunity page linked in this listing — it carries the sponsor's submission instructions.
Between FY2021 and FY2025, the National Institute of Standards and Technology made 1,579 awards totaling about $2.4 billion to 505 recipients, with a median award of $249,994. The University of Delaware ($181.5 million) and the University of Maryland, College Park ($148.4 million) led the recipient list, and 53 percent of recipients won more than one separate award.
| Organization | Total awarded |
|---|---|
| University of Delaware(DE) | $181.5M |
| University of Maryland, College Park(MD) | $148.4M |
| The Regents of the University of Colorado(CO) | $121.7M |
| University of South Alabama(AL) | $60.0M |
| California Manufacturing Technology Consulting(CA) | $59.7M |
| University of Missouri System(MO) | $46.5M |
| University of Maine System(ME) | $44.8M |
| University of Alabama(AL) | $44.6M |
Linked organizations have Granted profiles. Top recipients of National Institute of Standards and Technology (NIST) assistance awards, FY2021–FY2025, ranked by total obligations (CFDA 11.6.x). Source: USAspending. Last verified July 2026.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology. The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for semiconductor advanced packaging. The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals relevant to one or more of five R&D areas: Equipment, Tools, Processes, and Process Integration; Power Delivery and Thermal Management; Connector Technology, Including Photonics and Radio Frequency (RF); Chiplets Ecosystem; and Co-design/Electronic Design Automation (EDA). In addition to the R&D areas, the NOFO is expected to include a specific opportunity for prototype development in exemplar application areas such as high-performance computing and low-power systems needed for AI. Action: Notice of intent (NOI). Published in the Federal Register on 2024-07-09. Federal Register document number: 2024-14980.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology. The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. CHIPS R&D anticipates making available up to approximately $300,000,000 for multiple awards in amounts up to approximately $100,000,000 per award, not including voluntary co- investment, over up to 5 years and made through cooperative agreements or other transactions. The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals. Action: Notice of Intent (NOI). Published in the Federal Register on 2024-02-01. Federal Register document number: 2024-02026.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development is sponsored by Commerce Department; National Institute of Standards and Technology. The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. CHIPS R&D anticipates making available up to approximately $300,000,000 for multiple awards in amounts up to approximately $100,000,000 per award, not including voluntary co- investment, over up to 5 years and made through cooperative agreements or other transactions. The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals. Action: Notice of Intent (NOI). Published in the Federal Register on 2024-02-01. Federal Register document number: 2024-02026.
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