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Find similar grantsAccelerate Idaho AI Innovation Awards 2026 is sponsored by Idaho State Board of Education. Supports projects integrating AI literacy into teaching and learning to improve educational outcomes for postsecondary students in Idaho.
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Limited Submission Notice: Accelerate Idaho AI Innovation Awards 2026 - Office of Sponsored Programs Office of Sponsored Programs Idaho State Board of Education (OSBE), U.S. Department of Education Fund for the Improvement of Postsecondary Education (FIPSE) The Accelerate Idaho AI Innovation Awards is a competitive institutional grant program established under the Accelerate Idaho: An AI-Powered Future for Teaching and Learning Initiative.
As part of the U.S. Department of Education Fund for Improvement Of Postsecondary Education (FIPSE), proposals must directly address FIPSE Absolute Priority 1: Advancing Artificial Intelligence to Improve Educational Outcomes of Postsecondary Students, which prioritizes projects that improve academic instruction and student learning through one or more of the following components: Supporting the integration of AI literacy skills and concepts into teaching and learning practices to improve educational outcomes for students, including instruction about how to use AI responsibly, and how to detect AI-generated disinformation or misinformation online; and/or Partnering with State Educational Agencies (SEAs) or Local Educational Agencies (LEAs) to: Use AI technology to provide high-quality instructional resources, high-impact tutoring, and college and career pathway exploration, advising, and navigation to improve educational outcomes; Integrate AI-driven tools into classrooms to personalize learning, improve student outcomes, and support differentiated instruction — including adaptive learning technologies, virtual teaching assistants, tutoring, and data analytics tools to support student progress; and/or Utilize AI in the classroom and/or for school operation efficiency, including improving teacher training and evaluation, reducing time-intensive administrative tasks, or improving instruction or services for students with disabilities.
Up to $300,000 for up to 4 years, no more than $150,000 in any single year Limited Submission Requirements and Timeline Three (3) proposals per institution is permitted. Only proposals approved by the Division of Research and Economic Development may be submitted to this program. For such approval, PIs must first submit a white paper form by 4 pm on June 22, 2026.
Please complete the White Paper submission form. White paper instructions and review criteria are outlined in the form.
White Paper Submission Form June 22, 2026 by 4 pm – White Paper due July 6, 2026 – Anticipated date applicants will be notified of approval July 8, 2026 – Proposal Intake Form due to OSP Pre-Award July 10, 2026 – Optional Letter of Intent due to OSBE July 31, 2026 by 9 am – Final documents due to OSP August 7, 2026 – Full proposal due to OSBE Additional Information from the Sponsor Wednesday, June 10, 4-5pm MT, webinar link Wednesday, June 24, 4-5pm MT, webinar link July 1 – August 5, 4-5pm MT, office hours link The optional Letter of Intent (due July 10) allows OSBE to provide feedback before full proposal submission.
Copy preaward@boisestate. edu on the submission email. Review all Limited Submission Notices Please send all inquiries for Limited Submission opportunities to limitedsubmissions@boisestate.
edu Office of Sponsored Programs Yanke Family Research Park, Boise, ID 83706
According to the current listing, eligibility includes: Idaho public colleges and universities. Confirm the full requirements in the official notice before applying.
Accelerate Idaho AI Innovation Awards 2026 is funded by Idaho State Board of Education. Verify program details on the funder's official page before applying.
This opportunity targets applicants in Idaho. If your organization operates elsewhere, check the official notice for location requirements.
Start from the official opportunity page linked in this listing — it carries the sponsor's submission instructions.
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