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AI Innovation Package (Financial support through Horizon Europe and Digital Europe programmes dedicated to generative AI) is sponsored by European Commission. The European Commission's AI Innovation Package aims to support European startups and SMEs in the development of trustworthy, safe, and ethical Artificial Intelligence (AI) that respects EU values and rules.
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Or search similar grants →According to the current listing, eligibility includes: European startups and SMEs working on trustworthy, safe, and ethical AI that respects EU values and rules. Confirm the full requirements in the official notice before applying.
The current listing shows varies (part of a €4 billion public and private investment until 2027). Verify award ceilings, matching requirements, and allowable costs in the official notice.
AI Innovation Package (Financial support through Horizon Europe and Digital Europe programmes dedicated to generative AI) is funded by European Commission. Verify program details on the funder's official page before applying.
Start from the official opportunity page linked in this listing — it carries the sponsor's submission instructions.
Supply Chain Development (within the International Technology Security and Innovation (ITSI) Fund) is sponsored by U.S. Department of State, Bureau of Economic and Business Affairs (EB). This solicitation, specific to Mexico, invites statements of interest (SOI) for programs under the ITSI Fund to help expand international semiconductor assembly, testing, and packaging (ATP) capacity in key partner countries.
Call with Digital Partnership and TTC countries is sponsored by European Commission — Horizon Europe. Expected Outcome: The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes: • Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications. • Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint. • Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration. Programme areas: Horizon Europe (HORIZON), Global Challenges and European Industrial Competitiveness, Digital, Industry and Space