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The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.
Funding Opportunity Number: 2023-NIST-CHIPS-SMME-01. Assistance Listing: 11.037. Funding Instrument: CA. Category: ST.
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Or search similar grants →According to the current listing, eligibility includes: Eligible applicants: Others (see text field entitled Additional Information on Eligibility for clarification). An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment. Confirm the full requirements in the official notice before applying.
Applications for CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment are due November 1, 2026. Build your timeline backwards from this date to cover registrations, approvals, and final submission checks.
Yes — CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment is offered by National Institute of Standards and Technology and this listing comes from Grants.gov, an official U.S. federal source. Federal applications generally require registrations (for example SAM.gov or an agency submission portal), so allow extra lead time.
Start from the official opportunity page linked in this listing — it carries the sponsor's submission instructions.
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