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Find similar grantsThis program supports research and development activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, which are key technologies for manufacturing semiconductors.
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Or search similar grants →According to the current listing, eligibility includes: Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tr…. Confirm the full requirements in the official notice before applying.
The current listing shows up to $100,000,000 per award (totaling approximately $300,000,000). Verify award ceilings, matching requirements, and allowable costs in the official notice.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development is funded by U.S. Department of Commerce / NIST CHIPS for America. Verify program details on the funder's official page before applying.
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