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Find similar grantsCo-packaging Digital Readout Integrated Circuits and Photonics for Advanced Infrared Imaging (OSW26BZ05-NV021) is sponsored by Department of Defense (DoD). This SBIR topic aims to demonstrate high-speed, ultra-low-power optical channel operations within cryogenic environments.
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Or search similar grants →According to the current listing, eligibility includes: Small businesses (fewer than 500 employees) located in the United States, with at least 50% equity owned by U. S. citizens or permanent residents. Universities can participate as subrecipients/contractors. Confirm the full requirements in the official notice before applying.
The published deadline was September 23, 2026, which has passed. Check the official notice for any future application windows before investing time in a proposal.
Co-packaging Digital Readout Integrated Circuits and Photonics for Advanced Infrared Imaging (OSW26BZ05-NV021) is funded by Department of Defense (DoD). Verify program details on the funder's official page before applying.
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