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Find similar grantsCybersecurity Research and Development (Cyber R&D) Program is sponsored by National Institute of Standards and Technology (NIST). Supports research in cybersecurity, including AI-driven privacy and safety solutions.
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Research & Development Programs | NIST https://www. nist. gov/chips/research-development-programs Research & Development Programs The purpose of the CHIPS Research and Development (R&D) programs is to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry.
The CHIPS R&D programs have three goals: To establish the capacity to invent, develop, prototype, and deploy the foundational semiconductor technologies of the future – here in America; To accelerate ideas to market. We want the best ideas to achieve commercial scale as quickly and cost effectively as possible; and To contribute to a robust semiconductor workforce.
We want enough inventors, designers, researchers, developers, engineers, technicians, and staff to meet the needs of government and commercial sectors. The NIST Nanofabrication Facility in an ultraclean wing of the Advanced Measurement Laboratory. National Semiconductor Technology Center – A public-private consortium that will serve as the focal point for semiconductor research for the nation.
CHIPS Manufacturing USA Institute – CHIPS for America established a new Manufacturing USA institute, known as SMART USA (Semiconductor Manufacturing and Advanced Research with Twins USA), dedicated to digital twin technology for semiconductor manufacturing technologies and related workforce training. Learn more about the institute .
CHIPS Metrology – NIST will conduct the measurement science, or metrology, critical to the development of new materials, packaging, and production methods for semiconductors. NIST will also work on reference materials, reference data, and calibrations for the precision equipment used in chip manufacturing, and advise on the development of standards for processes and cybersecurity.
The Industrial Advisory Committee provides advice to the Secretary of Commerce through NIST on matters relating to microelectronics research, development, manufacturing, and policy — including assessment of the research and development programs that make up the CHIPS for America R&D Office.
Across the entire semiconductor industry, issues related to thermomechanical mismatches encountered during packaging are limiting factors in the design and fabrication of 3D modular integrated circuits. This project will develop novel and necessary metrologies for thermomechanical properties of... Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging.
Needs such as fine pitch interconnects Continuous advances in the performance and functionality of semiconductor devices have been driven by scale reduction, incorporation of new and nanomaterials, and by heterogeneous integration (HI). However, such scaling and integrated architecture has rendered existing thermal metrology inadequate...
Conventional TEM imaging was sufficient for decades in the semiconductor industry, but its utility is declining as device designs become more complex and as feature sizes continue to shrink. Conventional imaging modes are challenged by the small, complex structures which are vital to current and...
According to the current listing, eligibility includes: Universities, non-profit organizations, and other research institutions. Confirm the full requirements in the official notice before applying.
Cybersecurity Research and Development (Cyber R&D) Program is funded by National Institute of Standards and Technology (NIST). Verify program details on the funder's official page before applying.
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NIST is pausing all submissions under the CRDO Broad Agency Announcement (2025-NIST-CHIPS-CRDO-01) on September 15, 2026 for system upgrades — no white papers, no pre-negotiation packages, no investment fund applications until roughly November. Here is what the pause means for a $10M-minimum rolling BAA that runs through 2029, and how to use the dark window.
Read articleThe FY2026 MEP Center State Competition ran in two rounds: eight states worth $139.1 million, then fourteen more worth $232.4 million, both closing August 21, 2026. That's 43 percent of the national network recompeted in twelve months, under a 50 percent non-federal cost share, while the administration's own budget request proposed eliminating the program. Here's what the award tables reveal, why incumbents are genuinely at risk, and how to position for the FY2027 wave.
Read articleNIST's July 2026 MEP funding opportunity opens 14 state and territory centers — from California's $15.6M to Alaska's $706K — to new operators under cooperative agreements requiring a 50% nonfederal match. Applications are due August 21, 2026, with a July 28 webinar. Here is who can compete, how the match works, and why this recompete matters for every small manufacturer in those 14 states.
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