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Page references Fall 2024 solicitations but no May 27, 2026 deadline is visible on the page. Stored deadline of 2026-05-27 could not be confirmed from the program page.
"High-Performance Computing for Manufacturing (HPC4Mfg) Program" is currently closed and not accepting applications.
High-Performance Computing for Manufacturing (HPC4Mfg) Program is sponsored by U.S. Department of Energy (DOE), Advanced Materials & Manufacturing Technologies Office (AMMTO) and Industrial Technologies Office (ITO). This program provides access to DOE's powerful supercomputers and expertise to small and medium-sized manufacturers to improve America's manufacturing competitiveness.
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High-Performance Computing for Advanced Manufacturing | Department of Energy High-Performance Computing for Advanced Manufacturing The national laboratories of the U.S. Department of Energy (DOE) possess world-class expertise in high-performance computing (HPC) and operate some of the world’s most powerful computers. Complex computational studies can yield valuable insights and improve technology across scientific disciplines.
Leveraging DOE’s HPC resources can expedite the development of energy-efficient manufacturing processes across U.S. industry—saving energy, reducing emissions, boosting competitiveness, and building global technology leadership. Find funding to utilize DOE’s network of supercomputers. Browse dozens of supercomputers and view their capabilities.
Learn More about Computing Resources Learn about the details of past project awards. Learn More about Project Selections Read about how access to HPC helped manufacturers improve their processes. Learn More about Success Stories FOR ADDITIONAL INFORMATION, PLEASE CONTACT: U.S. Department of Energy Advanced Materials and Manufacturing Office Email: paul.
syers@ee. doe. gov The DOE launched the High-Performance Computing for Manufacturing (HPC4Mfg) program in 2015 to create targeted partnerships between U.S. manufacturers and the national laboratories.
Under this program, competitively selected projects apply modeling, simulation, and data analysis to industrial processes and products to lower production costs and shorten the time to market. The aim is to advance future technology investments by optimizing designs, predicting performance, and reducing the number of testing cycles during development.
In each case, the industry partner identifies the manufacturing challenge to ensure that the process or product will have direct commercial impacts. This program is designed to foster an open exchange of best practices and know-how, breaking down communication barriers between world-class researchers, equipment suppliers, and manufacturing companies.
Computer scientists at the national laboratories will benefit by expanding software codes for application to diverse problem sets. In the short term, industry benefits by reducing investment risk and improving energy efficiency. In the longer term, the U.S. manufacturing sector will increasingly turn to HPC modeling and simulation as trusted tools to accelerate innovation and achieve significant energy and cost savings.
According to the current listing, eligibility includes: U.S. manufacturers experiencing specific manufacturing challenges with potential commercial impact, partnering with DOE national laboratories. Confirm the full requirements in the official notice before applying.
The current listing shows up to $400,000 per project; over $10 million total available. Verify award ceilings, matching requirements, and allowable costs in the official notice.
The published deadline was May 27, 2026, which has passed. Check the official notice for any future application windows before investing time in a proposal.
High-Performance Computing for Manufacturing (HPC4Mfg) Program is funded by U.S. Department of Energy (DOE), Advanced Materials & Manufacturing Technologies Office (AMMTO) and Industrial Technologies Office (ITO). Verify program details on the funder's official page before applying.
Yes — this listing is flagged as national in scope, so applicants across the U.S. may apply, subject to the sponsor's other eligibility criteria.
Applications go through the funder's official portal — the Apply Now link on this page goes there directly.
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