Mobile & Manufactured Home Replacement Program

The ARM Institute's 27-01 Core-Funded Technology Project Call is the current cycle of the institute's recurring robotics funding programme, and this round is framed explicitly around Robotics and Physical AI Defense Manufacturing Solutions. ARM is a Manufacturing USA institute funded by the Office of the Secretary of Defense with a consortium of more than 450 industry, academic and government members, and its project calls exist to push robotics, autonomy and AI into U.S. manufacturing rather than to fund basic research. The 27-01 call targets defense manufacturing needs including high-mix castings and forgings, naval vessels, unmanned systems, munitions, and rapid production expansion, with a strong preference for dual-use technology that also benefits the broader U.S. manufacturing base. The preceding 26-01 call, a useful guide to scale and topic style, made roughly USD 2,000,000 available with a USD 500,000 per-project cap and named topic areas of Multi-Modal Inputs for AI Robotics in Manufacturing, Rapid Re-Tasking and Robot Agility, Multi-Robot and Multi-Human Collaboration and Supervised Autonomy, Adaptive Real-Time Path Planning and Control, and Mobile Robotics. The single most important eligibility constraint is membership: only ARM Institute members may submit, so non-members intending to apply need to start the membership process well ahead of the deadlines. The process is two-stage - concept papers are due 16 September 2026 and final submissions by 2 December 2026 at 5:00 PM ET, with a target project start on or before 1 February 2027 and project end by 31 January 2028, which implies a tightly scoped twelve-month execution plan rather than a multi-year research programme.

Call with Digital Partnership and TTC countries is sponsored by European Commission — Horizon Europe. Expected Outcome: The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes: • Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications. • Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint. • Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration. Programme areas: Horizon Europe (HORIZON), Global Challenges and European Industrial Competitiveness, Digital, Industry and Space