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First NOFO round finalized with awards announced November 2024; no new active solicitation found on the page.
National Advanced Packaging Manufacturing Program (NAPMP) is sponsored by U.S. Department of Commerce, NIST (CHIPS R&D). This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging.
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National Advanced Packaging Manufacturing Program | NIST https://www. nist.
gov/chips/research-development-programs/national-advanced-packaging-manufacturing-program CHIPS FOR AMERICA / Research & Development Programs National Advanced Packaging Manufacturing Program CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Awards The CHIPS NAPMP has finalized $300 million in award funding under its first Notice of Funding Opportunity (NOFO) for advanced substrates and material research to Absolics Inc., Applied Materials Inc., and Arizona State University to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
These awards will help establish a self-sustaining, high-volume, domestic, advanced packaging industry where advanced node chips are both manufactured and packaged in the United States. You can learn more about the awardees here . “Advanced packaging” refers to many chips with diverse functions assembled tightly together on a substrate in two or three dimensions at extremely fine dimensions.
This method achieves function, performance, and power savings far greater than can be achieved with conventionally packaged chips on a printed circuit board. Recent advances in artificial intelligence, for example, would not be possible without advanced packaging. Advanced packaging can be a transformative capability that helps U.S. manufacturers compete globally, but there are many technological challenges to solve.
The CHIPS Research and Development Office has established the CHIPS National Advanced Packaging Manufacturing Program to address these challenges, including: How do we design and assemble chips so tightly that they behave like a single traditional large chip, but with the production efficiency and cost savings of advanced packaging? How do we supply power to and dissipate heat from such tightly coupled assemblies?
How do we test and repair such complex assemblies? How do we ensure their reliability since traditional methods of visual inspection cannot be performed on such small, tightly packaged dimensions? Investments in semiconductors will not succeed without investments in advanced packaging.
The CHIPS and Science Act offers a once-in-a-generation opportunity to establish a domestic competitive advanced packaging capability in semiconductor manufacturing. In addition, the CHIPS NAPMP will help train semiconductor personnel and students in relevant technologies and feed these developments into domestic manufacturing facilities.
The CHIPS NAPMP will work closely with the CHIPS National Semiconductor Technology Center , the semiconductor-related CHIPS Manufacturing USA Program , the CHIPS Metrology Program , and U.S. industry and academia to make this vision a reality.
The CHIPS NAPMP will enable the development of a robust domestic advanced packaging ecosystem by: Accelerating the transfer of innovations in packaging, equipment, and process development into manufacturing; Driving the development of digital tools to reduce the time and cost of advanced packaging engineering; and, Establishing and supporting partnerships among industry, academia and training entities, and government to contribute to an advanced packaging workforce.
According to the current listing, eligibility includes: Domestic accredited institutions of higher education; State, local, and Tribal governments; and domestic for-profit organizations. Confirm the full requirements in the official notice before applying.
The current listing shows CHIPS R&D anticipates reserving up to $50,000,000 to support recipients under this NOFO pursuing prototyping activities. Verify award ceilings, matching requirements, and allowable costs in the official notice.
National Advanced Packaging Manufacturing Program (NAPMP) is funded by U.S. Department of Commerce, NIST (CHIPS R&D). Verify program details on the funder's official page before applying.
Yes — this listing is flagged as national in scope, so applicants across the U.S. may apply, subject to the sponsor's other eligibility criteria.
Start from the official opportunity page linked in this listing — it carries the sponsor's submission instructions.
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