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Find similar grantsThis program funds research and innovation in sustainable packaging for U. S. specialty crop exports to address global regulatory changes and support the commercialization of reusable or packaging-free solutions.
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Or search similar grants →According to the current listing, eligibility includes: No matching funds required; international applicants must collaborate with U. S. -based partners. The program supports applied R&D, technology acceleration, and pilot-scale manufacturing. Confirm the full requirements in the official notice before applying.
The current listing shows $50,000–$250,000 per award. Verify award ceilings, matching requirements, and allowable costs in the official notice.
Applications for Packaging Innovation Program are due December 17, 2026. Build your timeline backwards from this date to cover registrations, approvals, and final submission checks.
Packaging Innovation Program is funded by Foundation for Food and Agriculture Research (FFAR). Verify program details on the funder's official page before applying.
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Supply Chain Development (within the International Technology Security and Innovation (ITSI) Fund) is sponsored by U.S. Department of State, Bureau of Economic and Business Affairs (EB). This solicitation, specific to Mexico, invites statements of interest (SOI) for programs under the ITSI Fund to help expand international semiconductor assembly, testing, and packaging (ATP) capacity in key partner countries.
Call with Digital Partnership and TTC countries is sponsored by European Commission — Horizon Europe. Expected Outcome: The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes: • Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications. • Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint. • Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration. Programme areas: Horizon Europe (HORIZON), Global Challenges and European Industrial Competitiveness, Digital, Industry and Space
Missouri's Department of Agriculture has reopened its Urban Agriculture Cost-Share Grant — reimbursing 75% of project costs up to $10,000, with applications due September 15, 2026. A companion Food Insecure Cost-Share Grant closes August 26. Here is how these small, fast state grants work, who qualifies under the Census 'urban area' definition, and how to layer them with the federal USDA Urban Agriculture and Innovative Production program for a durable urban-farming funding strategy.
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