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Find similar grantsQualcomm Innovate in Taiwan Challenge 2025 is sponsored by Qualcomm Technologies, Inc.. Qualcomm Innovate in Taiwan Challenge (QITC) 2025, sponsored by Qualcomm Technologies, Inc.
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[](https://www. qualcomm. com/) Innovate in Taiwan Challenge Qualcomm Innovate in Taiwan Challenge Ap...
Innovate in Taiwan Challenge Qualcomm Innovate in Taiwan Challenge Ap... # Qualcomm Innovate in Taiwan (QITC) 2026 Application & Selection Process QITC 2026 is open for registration from now until 31 March 2026. The process of applying is simple.
Just fill out the registration form with all the required information, read and accept the Official Rules for QITC 2026, and submit your idea. There is no entry fee or additional step needed to apply. There is no entry fee to participate in QITC 2026.
Participation is voluntary and open to companies incorporated and registered in Taiwan. Taiwanese companies that have a great product idea that use our platforms and is focused on one of the specified technology areas for QITC 2026 (AI PC, Edge AI, 5G, IoT or smart cities) are encouraged to apply. Each team should submit ONE application.
It is not necessary for each member of the team to fill in the form. **Selection Criteria**Qualcomm Technologies will consider every proposal based on its merits, weighing a variety of factors such as innovativeness, utility value, market relevance, design compatibility with our chipsets/solutions, robustness of product design, time-to-market advantage, and business potential. **Shortlisting Timeline**Applications must be in by 11:59 p.
m. National Standard Time (Taiwan) on **31 March 2026**. The shortlisted teams will be announced later in April / May.
Shortlisted participants will be informed of their selection by Qualcomm Technologies and will be published on the website. **Shortlisting Jury**The jury panel will be comprised of Qualcomm employees that have extensive industry and business experience. Please login with your Qualcomm ID to access Workspace [](https://www.
qualcomm. com/) Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries.
At Qualcomm, we are engineering human progress. [](https://www. linkedin.
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According to the current listing, eligibility includes: Companies incorporated and registered in Taiwan. Confirm the full requirements in the official notice before applying.
Qualcomm Innovate in Taiwan Challenge 2025 is funded by Qualcomm Technologies, Inc.. Verify program details on the funder's official page before applying.
Start from the official opportunity page linked in this listing — it carries the sponsor's submission instructions.
America's Seed Fund powered by NSF reopened for FY2026 with two parallel solicitations: NSF 26-510 for deep technologies and a new pilot, NSF 26-511, dedicated to scientific instrumentation. Project Pitch is the mandatory first gate, the first full-proposal deadline is July 27, 2026, and Phase I runs up to $305K. Here is how the topic-agnostic NSF model differs from agency-directed SBIR — and how to use the new pilot.
Read articleOn June 3, 2026, four DARPA Biological Technologies Office SBIR topics close simultaneously — SWiFT, BARK, EXPOSITION, and Medical Swarm Robotics. Combined Phase I plus Phase II potential exceeds $6 million per company, and together they sketch a coherent strategy of distributed, autonomous, dual-species combat casualty care that depends on small businesses, not primes, to actually build.
Read articleDPA26BZ06-DV026 offers $300,000 at Phase I or $1,800,000 as a single Direct-to-Phase-II tranche with no options. The deliverable is a simulated auction market that measures whether AI agents deceive, collude, or manipulate the humans they serve — measured entirely from the outside. Here is the 90% efficiency gate, the team composition most bidders will get wrong, and why this topic sits in DARPA's biology office.
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