Robust Integrated Power Electronics (RIPE)

Robust Integrated Power Electronics (RIPE) is sponsored by Defense Advanced Research Projects Agency (DARPA). DARPA is soliciting research proposals in the area of Robust Integrated Power Electronics (RIPE).

Robust Integrated Power Electronics (RIPE) - Federal Grant Robust Integrated Power Electronics (RIPE) The summary for the Robust Integrated Power Electronics (RIPE) grant is detailed below. This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants.

Verify the accuracy of the data FederalGrants. com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact . If any section is incomplete, please visit the website for the Defense Advanced Research Projects Agency, which is the U.S. government agency offering this grant.

Robust Integrated Power Electronics (RIPE): The Defense Advanced Research Projects Agency (DARPA) is soliciting research proposals in the area of Robust Integrated Power Electronics (RIPE). Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices or systems. Specifically excluded is research which primarily results in evolutionary improvement to the existing state of practice.

Power electronics play a critical role in nearly every military and commercial system by providing high quality power from the energy sources to the loads with low parasitic losses. Modern power electronics are often manufactured from the silicon semiconductor material.

While silicon-based power electronics are ubiquitous and mature, there are inherent limitations in frequency, voltage, current, and performance due to the underlying material properties. New semiconductor material systems may enable development of more compact, more efficient, more robust power electronics.

The Robust Integrated Power Electronics (RIPE) Program intends to pursue research and development of the most promising devices and circuits in these material systems, and to explore the integration of those new technologies with other electronics and components to provide significant overall enhancements in power electronics or electronics for harsh environments.

DARPA seeks innovative proposals in the following areas: devices and circuits, reactive components and assemblies, and applications. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 04-22 Proposer Information Pamphlet referenced below. PROGRAM SCOPEMultiple awards are anticipated.

Collaborative efforts/teaming are encouraged. A web site--http://teaming. sysplan.

com/RIPE/ --has been established to facilitate formation of teaming arrangements between interested parties. Specific content, communications, networking, and team formation are the sole responsibility of the participants. Neither DARPA nor the Department of Defense (DoD) endorses the destination web site or the information and organizations contained therein, nor does DARPA or the DoD exercise any responsibility at the destination.

This web site is provided consistent with the stated purpose of this BAA. Cost sharing is not required and is not an evaluation criterion but is encouraged where there is a reasonable probability of a potential commercial application related to the proposed research and development effort. The technical POC for this effort is Daniel J.

Radack, fax: (703) 696-2206, electronic mail: [email protected] .

GENERAL INFORMATIONProposers must obtain a pamphlet entitled BAA 04-22, Robust Integrated Power Electronics (RIPE), Proposer Information Pamphlet, which provides further information on areas of interest: devices and circuits, reactive components and assemblies, and applications; the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information.

This pamphlet may be obtained from the FedBizOpps website: http://www. fedbizopps. gov/, World Wide Web (WWW) at URL http://www.

darpa. mil/ or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed.

In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and six (6) copies of the proposal abstract and two electronic copies (i.e., two separate disks) of the abstract [in PDF (preferred), MS-Word readable, HTML, or ASCII format each on a CD-ROM (preferred), a single 3. 5 inch High Density MS-DOS formatted 1.

44 Megabyte (MB) diskette, or a single 100 MB Iomega Zip?? disk] should be submitted. Offerors may optionally include a short viewgraph summary of their proposed effort.

This summary should not exceed two (2) slides in conventional presentation format and should be in either PowerPoint or PDF format. Each disk must be clearly labeled with BAA 04-22, proposer organization, proposal title (short title recommended) and Copy __ of 2. The proposal abstract (original and designated number of hard and electronic copies) must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.

: BAA 04-22), and must be received by DARPA on or before 4:00 p. m. , local time, Friday, May 7, 2004.

Proposal abstracts received after this time and date may not be reviewed. Upon review of the abstract, DARPA will provide written notice on the likelihood of a full proposal being considered for selection, and the time and date for submission of a full proposal.

Proposers not submitting proposal abstracts must submit an original and six (6) copies of the full proposal and two electronic copies (i.e., two separate disks) of the full proposal [in PDF (preferred), MS-Word readable, HTML, or ASCII format, each on a CD-ROM (preferred), a single 3. 5 inch High Density MS-DOS formatted 1. 44 Megabyte (MB) diskette, or a single 100 MB Iomega Zip??

disk]. Each disk must be clearly labeled with BAA 04-22, proposer organization, proposal title (short title recommended) and Copy __ of 2. Offerors may optionally include a short viewgraph summary of their proposed effort.

This summary should not exceed four (4) slides in conventional presentation format and should be in either PowerPoint or PDF format. The full proposal (original and designated number of hard and electronic copies) must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn. : BAA 04-22), and must be received by DARPA on or before 4:00 p.

m. , local time, Monday, June 28, 2004, in order to be considered during the initial round of selections; however, proposals received after this deadline may be received and evaluated up to one year from date of posting on FedBizOpps. Full proposals submitted after the due date specified in the BAA or due date otherwise specified by DARPA after review of proposal abstracts may be selected contingent upon the availability of funds.

This notice, in conjunction with the BAA 04-22 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded.

The Government reserves the right to select for award all, some, or none of the proposals received, and to make awards without discussions. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Input on technical aspects of the proposals may be solicited by DARPA from non-Government consultants/experts who are bound by appropriate non-disclosure requirements.

Non-Government technical consultants/experts will not have access to proposals that are labeled by their offerors as Government Only.

Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in Robust Integrated Power Electronics.

All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 04-22.

Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided.

EVALUATION CRITERIAEvaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (1) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism.

Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort.

The administrative addresses for this BAA are:Fax: (703) 351-8710 (Addressed to: DARPA/MTO, BAA 04-22), Electronic Mail: [email protected] : DARPA/MTO, ATTN: BAA 04-22 3701 North Fairfax Drive Arlington, VA 22203-1714 This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www. darpa. mil/ in the solicitations area.

Robust Integrated Power Electronics (RIPE) Defense Advanced Research Projects Agency Funding Opportunity Number: Modification to Previous Grants Notice Cooperative Agreement Grant Procurement Contract Other Research and Technology Development Current Application Deadline: Original Application Deadline: Maximum Federal Grant Award: Minimum Federal Grant Award: Expected Number of Awards: Cost Sharing or Matching: Applicants Eligible for this Grant Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility" Link to Full Grant Announcement Grant Announcement Contact Ulrey, Scott, Director, Technology Division, Phone 703 696-2434, Fax 703-812-3316, Email [email protected] [email protected] Ulrey, Scott Similar Government Grants • Information Processing Techniques Office Office-Wide • Multi Modal Materials Analysis (MMoMA) • Decentralized Artificial Intelligence through Controlled Emergence (DICE) • Automated Discovery for Design and Control of Turbulent Systems (AutoDIDACTS) • Wide Band Gap Semiconductors for RF Applications (WBGS-RF) • Microantenna Arrays:Technology and Applications (MIATA) • Imaging Coherent Optical Radar (ICHOR) More Grants from the Defense Advanced Research Projects Agency • Biological Technologies • Mining and Understanding Software Enclaves (MUSE) • DARPA-BAA-13-11: Vetting Commodity IT Software and Firmware • Microsystems Technology Office-Wide Federal Grants by Category Grants for Single Mothers Small Business Grants for Women Federal Grants for College Federal Tuition Assistance