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Scalable Asymmetric Lifecycle Engagement (SCALE) Program is sponsored by U.S. Department of Defense (DoD). The SCALE program is a public-private-academic consortium focused on developing the microelectronics design and manufacturing workforce for the defense sector. It provides unique courses, mentoring, internships, and targeted research projects for college students in microelectronics specialty areas.
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SCALE Scalable Asymmetric Lifecycle Engagement | SCALE The goal of the SCALE program is to develop a microelectronics workforce that is well prepared to meet the needs of the Department of War and the Defense Industrial Base. SCALE: Leading U.S. semiconductor workforce development for defense.
Scalable Asymmetric Life Cycle Engagement (SCALE) is an immersive educational program that combines government/DIB internships with aligned research and mentoring to deepen understanding and relationship building for undergraduate and graduate students.
A Public-Private-Academic Partnership (PPAP) consortium-based approach was used to achieve national reach to the top universities in targeted microelectronics technical areas for scaling and replication of the program, while allowing a regional focus.
SCALE combines DoW governance with inputs from all PPAP sectors; a set of national curriculum standards aligned with DoW requirements in specialty areas that go beyond current ABET practice; a cohesive messaging and recruiting approach tailored for students from K-12 through Ph. D.
; an industry-supported Center for Secure Microelectronics Ecosystem (CSME) to engage students in transitioning research to specific missions; iterative adaptation of curricula and standards; and systematic programmatic evaluation to ensure increased effectiveness and government and industry workforce targets in quality and quantity.
The program was designed to be: - scalable to multiple universities - replicable to additional microelectronics topics important to the federal government and industry - and asymmetric in its effect in training US students in areas of high need. SCALE: Unparalleled Opportunity The Department of War has granted SCALE over $100 million in funding and committed to four more years of sponsorship.
SCALE goals for the next five years include: Continuing to spearhead the development of the semiconductor workforce by offering unique courses, mentoring, internships, targeted research projects, scholarships and job placement assistance for both undergraduate and graduate students.
Growing to over 2,000 students and 40 universities Achieving sustainable K-12 classroom engagements across the U.S. Enhancing the microelectronics curriculum at community colleges and offering continuing education programs for practicing professionals Co-directors Dr. Peter Bermel and Dr. Kerrie Douglas share the goals and methods of SCALE and why the SCALE approach is unique and successful.
The strength of the SCALE program is in connection and collaboration. Students connect to targeted learning opportunities in advanced technologies and apply this knowledge through internships and early career roles. Faculty across universities collaborate on cutting-edge research and teaching methods.
Defense-related government and private organizations offer insights to specific workforce needs and career pathways. What’s Happening with SCALE Introduction to Engineering with Microelectronics - Curriculum Plan
According to the current listing, eligibility includes: FFRDCs can participate as partners in the SCALE consortium. Purdue University leads the academic consortium, which includes 35 member universities. FFRDCs are eligible subrecipients under certain related CHIPS R&D funding opportunities. Confirm the full requirements in the official notice before applying.
The current listing shows over $100 million in total funding (distributed among partner universities). Verify award ceilings, matching requirements, and allowable costs in the official notice.
Scalable Asymmetric Lifecycle Engagement (SCALE) Program is funded by U.S. Department of Defense (DoD). Verify program details on the funder's official page before applying.
Start from the official opportunity page linked in this listing — it carries the sponsor's submission instructions.
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