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Find similar grantsSEMI FlexTech Flexible Electronics Projects is sponsored by SEMI FlexTech (with U.S. Army Research Laboratory support). SEMI FlexTech offers R&D funding through public-private partnerships for flexible hybrid electronics projects.
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SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics - Semiconductor Digest SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics FlexTech , a SEMI Technology Coalition, today issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.
Selected projects will receive cash awards ranging from $250,000 to $500,000. The program is funded by the Army Research Laboratory (ARL) . ARL funding will be matched with contributions by selected recipients to cover total project cost.
The RFP seeks proposals targeting FHE advances in the following areas: Flexible, Moldable Electronics Advanced Bonding Reliability Novel Flexible Energy Storage Beyond Conventional Architectures Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths. See the FlexTech 2026 RFP for more details on the evaluation process. Full proposal submissions are due July 6, 2026.
Awardees will be notified following the review of proposals by the RFP committee. The committee consists of FlexTech Council members and other subject matter experts (SMEs).
Evaluation criteria include: Dual-use (industry and military) applicability Relevance to the topics and the FHE ecosystem Reasonable and stretch deliverables Informational Webinar on May 20, 2026 To help organizations craft their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on May 20, 2026 at 10:00 a. m. PDT.
A recording will be available for registrants unable to attend the event. Register for the webinar. FlexTech RFPs support technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals.
FlexTech encourages partnerships among industrial companies, R&D organizations, and university teams. Development partners retain ownership of intellectual property developed under FlexTech agreements. If you have any questions, please contact [email protected] .
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According to the current listing, eligibility includes: Flexible electronics industry participants. Proposals are selected through a competitive bid process. Confirm the full requirements in the official notice before applying.
The current listing shows typical funding is a 50/50 cost share with industry participants; over $220 million public/private investment to date. Verify award ceilings, matching requirements, and allowable costs in the official notice.
SEMI FlexTech Flexible Electronics Projects is funded by SEMI FlexTech (with U.S. Army Research Laboratory support). Verify program details on the funder's official page before applying.
Start from the official opportunity page linked in this listing — it carries the sponsor's submission instructions.
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