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Find similar grantsSMART (Semiconductor Manufacturing Advanced Research and Training) Program is sponsored by University of California (in partnership with California businesses). The SMART Program is a University/Industry matching grants program that supports research and training in semiconductor equipment and materials manufacturing.
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Semiconductor Research Corporation - SRC Learn about our core values 2030 Decadal Plan for Semiconductors Research Experience for Undergrads Broadening Participation Pledge Our commitment to sustainability Learn about the Liaison program Use LinkedIn to find Research Scholars Learn about Pillar Science Industry resources for SRC researchers Launch Pillar Science research platform Find Talent in Pillar Science SRC Research Scholars: Getting Started members, academia, government partners intellectual property, elite workforce Project Solicitations Open Now!
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Join SMARTWORX Newly released, all-online roadmap includes chapter on Digital Twins Microelectronics & Advanced Packaging A plan to revitalize the semiconductor industry for decades to come Decadal Plan for Semiconductors The Decadal Plan for Semiconductors describes the possibilities for semiconductors in the coming decade and defines the challenges to overcome for realizing that vision Vision | Decadal Plan for Semiconductors Roadmap | Microelectronics & Advanced Packaging Private / Public Partnership between industry and DARPA building the future of microelectronics Together, we’re accelerating discovery—and advancing U.S. leadership in microelectronics for decades to come Through collaborative university research centers, the program fuels visionary science, develops future technical leaders, and drives innovations that will define next‑generation semiconductor capabilities.
ACE | Evolvable Computing for Next-Generation Distributed Computer Systems CHIMES | Center for Heterogeneous Integration of Micro Electronic Systems COCOSYS | Center for the Co-Design of Cognitive Systems COGNISENSE | Center on Cognitive Multispectral Sensors CUBIC | Center for Ubiquitous Connectivity PRISM | Center for Processing with Intelligent Storage and Memory SUPREME | Superior Energy-efficient Materials and Devices Membership | Learn more about joining SRC Membership | Learn more about joining SRC ACE | Evolvable Computing for Next-Generation Distributed Computer Systems COCOSYS | Center for the Co-Design of Cognitive Systems COGNISENSE | Center on Cognitive Multispectral Sensors CHIMES | Center for Heterogeneous Integration of Micro Electronic Systems PRISM | Center for Processing with Intelligent Storage and Memory SUPREME | Superior Energy-efficient Materials and Devices CUBIC | Center for Ubiquitous Connectivity Global Research Collaboration (GRC) Flexible international program in design and process areas semiconductor innovation at scale Global expertise.
Transformative research. SRC’s Global Research Collaboration program funds high‑impact, pre‑competitive university research that addresses the most critical challenges in semiconductor design, technology, and manufacturing.
Membership | Learn more about joining SRC CHIRP | Center for Heterogeneous Integration Research on Packaging TxACE | Texas Analog Center of Excellence AMS-CSD | Analog Mixed-Signal Circuits, Systems, and Devices CADT | Computer-Aided Design and Test EP3C | Efficiency and Performance for Connectivity Constrained Computing SemiSynBio | Semiconductor Synthetic Biology SLD | System Level Design LMD | Logic and Memory Devices NMP | Nano-manufacturing Materials and Processes ACE4S | ATIC-SRC Center of Excellence for Energy Efficient Electronics Systems EBSM | Engineering Research Center for Environmentally Benign Semiconductor Manufacturing TxACE | Texas Analog Center of Excellence ESH | Environmental, Safety & Health CHIRP | Center for Heterogeneous Integration Research on Packaging Membership | Learn more about joining SRC Join our members and research partners Contact Us Participating Universities 4819 Emperor Blvd, Suite 300 Durham, NC 27703 Voice: (919) 941-9400 Fax: (919) 941-9450 Access to information on this website may be limited to member companies, participating agencies, and qualified researchers.
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According to the current listing, eligibility includes: University/Industry partnerships involving California businesses and the University of California system. Focus on semiconductor equipment and materials manufacturing, research, and workforce training. Confirm the full requirements in the official notice before applying.
SMART (Semiconductor Manufacturing Advanced Research and Training) Program is funded by University of California (in partnership with California businesses). Verify program details on the funder's official page before applying.
This opportunity targets applicants in California. If your organization operates elsewhere, check the official notice for location requirements.
Start from the official opportunity page linked in this listing — it carries the sponsor's submission instructions.
IA Resilience call reinforcing Europe's strenght in power electronics is sponsored by European Commission — Horizon Europe. Scope: Proposals innovations should address one or more of the several domains : WBG substrates to reduce EU dependency on material and provide more sustainable, industrially compatible solutions. WBG platform for cost effectiveness, available in 300mm for GaN and/or SiC to improve yield and power density and close gaps in the value chain. A toolbox (e.g. wafer cut, smart stacking, thin layer transfer, epitaxy, UWBG materials) for further innovation schemes. Next generation or optimised new power semiconductor devices fitting their application. Adding intelligence to power semiconductor devices on control and/or sensor side. Facilitate the propagation of EU Packaging/Integration excellence along the entire value chain e.g. pre-packages or power semiconductor device packaging solutions to enable power device/system integration and strengthen Europe’s competitiveness in advanced packaging. Explore the use of heterogeneous and functional integration for improved performance, reliability, robustness and cost competitiveness. Rising operative voltage, frequency, current and thermal features that are common challenge on power electronics across the different application sectors. Provide stable and clean power supply that minimises disruptions, equipment failures, and data corruption. Advanced characterization techniques for new materials, devices, and systems. Implement AI at system level and/or make use of AI methods to increase the innovation speed. Programme areas: Horizon Europe (HORIZON), Global Challenges and European Industrial Competitiveness, Digital, Industry and Space
The NSF Future Manufacturing program supports fundamental research in robotics, artificial intelligence, quantum devices, semiconductor systems, biotechnology, sustainable chemistry, materials science, and workforce development as applied to future manufacturing processes. Future Manufacturing Seed Grants fund convergence research bringing together engineers, scientists, mathematicians, social and behavioral scientists, and STEM education researchers. AI-relevant thrust areas include autonomous manufacturing systems, AI-driven quality control, robotic assembly, smart material processing, human-robot collaboration, and manufacturing of quantum devices circuits and systems. All proposals must include plans to equip students and upskill the workforce for future manufacturing. Solicitation NSF 24-525 had a deadline of June 18 2025 with future cycles expected.
DARPA's DIAL program already had AI rediscover the Kalman filter and wavelets from scratch. SPEED DIAL (DPA26TZ05-DV003) funds the unglamorous next step: turning algorithm discovery into a tool that plugs into MATLAB, Simulink, and COMSOL. Up to $750,000 base plus a $1.25 million option, Direct to Phase II only, with a three-accomplishment feasibility gate and a mandatory university partner. Here is the milestone schedule, the interpretability requirement, and who is actually eligible.
Read articleRelease 6's SBIR topics got the attention. Its three STTR topics — SHIELDER, fuel-flexible electric propulsion, and hypersonic wind tunnel noise diagnostics — are all Direct-to-Phase-II, all require a research institution to perform at least 30 percent of the work, and all close October 21, 2026. The feasibility gates are the real filter.
Read articleOn June 1, DARPA and NSF announced AI Forge — a jointly governed forum that will fund university-led research on three thrusts: AI interpretability, AI control, and adversarial robustness. The RFI on sam.gov closes June 22, 2026, at 5:00 PM ET. Project Ventures awards run roughly $750K to $3M with one-year durations and multiple awards expected annually. Administration runs through a nonprofit, intellectual property will be shared via open-source licensing, and CAISI at NIST is the third partner. Here is what the 15 priority research challenges look like and how U.S. universities should respond.
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