Sustainable Packaging Innovation Lab (SPIL) - Assisting Specialty Crop Exports (ASCE) Initiative

Scientific Exchange Program (SEP) is sponsored by U.S. Department of Agriculture (USDA) Foreign Agricultural Service (FAS). The SEP program focuses on training and empowering fellows from low-to-middle income economies in Africa, with a focus on research related to increasing access to high-quality animal feed and innovative techniques for improved efficiency of fertilizers among African smallholder …

Cochran Fellowship Program is sponsored by U.S. Department of Agriculture (USDA) Foreign Agricultural Service (FAS). The Cochran Fellowship Program provides short-term training in the USA for senior and mid-level specialists and administrators from developing and emerging countries. The training focuses on agricultural trade, agribusiness development, and agricultural management, policy, and marketing.

Call with Digital Partnership and TTC countries is sponsored by European Commission — Horizon Europe. Expected Outcome: The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes: • Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications. • Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint. • Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration. Programme areas: Horizon Europe (HORIZON), Global Challenges and European Industrial Competitiveness, Digital, Industry and Space

IA Resilience call reinforcing Europe's strenght in power electronics is sponsored by European Commission — Horizon Europe. Scope: Proposals innovations should address one or more of the several domains : WBG substrates to reduce EU dependency on material and provide more sustainable, industrially compatible solutions. WBG platform for cost effectiveness, available in 300mm for GaN and/or SiC to improve yield and power density and close gaps in the value chain. A toolbox (e.g. wafer cut, smart stacking, thin layer transfer, epitaxy, UWBG materials) for further innovation schemes. Next generation or optimised new power semiconductor devices fitting their application. Adding intelligence to power semiconductor devices on control and/or sensor side. Facilitate the propagation of EU Packaging/Integration excellence along the entire value chain e.g. pre-packages or power semiconductor device packaging solutions to enable power device/system integration and strengthen Europe’s competitiveness in advanced packaging. Explore the use of heterogeneous and functional integration for improved performance, reliability, robustness and cost competitiveness. Rising operative voltage, frequency, current and thermal features that are common challenge on power electronics across the different application sectors. Provide stable and clean power supply that minimises disruptions, equipment failures, and data corruption. Advanced characterization techniques for new materials, devices, and systems. Implement AI at system level and/or make use of AI methods to increase the innovation speed. Programme areas: Horizon Europe (HORIZON), Global Challenges and European Industrial Competitiveness, Digital, Industry and Space