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Find similar grantsThis funding opportunity, supported by the CHIPS and Science Act, aims to accelerate domestic capacity for semiconductor advanced packaging through new research and development activities. The program seeks to enable innovative advanced packaging flows for U.
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Or search similar grants →According to the current listing, eligibility includes: U. S. semiconductor industry, including academic institutions, large and small businesses, and non-profit entities. Confirm the full requirements in the official notice before applying.
The current listing shows up to $1.6 billion (total for multiple awards, up to $150 million per award). Verify award ceilings, matching requirements, and allowable costs in the official notice.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development is funded by National Institute of Standards and Technology (NIST), Department of Commerce. Verify program details on the funder's official page before applying.
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