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Find similar grantsThis program, under the CHIPS and Science Act, aims to accelerate domestic capacity for advanced packaging substrates and substrate materials, which are key technologies for microelectronics systems.
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Or search similar grants →According to the current listing, eligibility includes: Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tr…. Confirm the full requirements in the official notice before applying.
The current listing shows up to $100 million each for specific projects (initial awards finalized). Verify award ceilings, matching requirements, and allowable costs in the official notice.
CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates is funded by National Institute of Standards and Technology (NIST), Department of Commerce. Verify program details on the funder's official page before applying.
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