Semiconductors (S) Topic - SBIR/STTR

Call with Digital Partnership and TTC countries is sponsored by European Commission — Horizon Europe. Expected Outcome: The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes: • Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications. • Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint. • Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration. Programme areas: Horizon Europe (HORIZON), Global Challenges and European Industrial Competitiveness, Digital, Industry and Space

AFWERX SBIR/STTR (Specific Topic Solicitations) is sponsored by AFWERX, Air Force Research Laboratory. AFWERX, a division of the Air Force Research Laboratory, opens new Small Business Innovation Research (SBIR) and Small Business Technology Transfer (STTR) solicitations. These solicitations fund feasibility studies, prototyping, and technology maturation aligned to Department of the Air Force (DAF) mission needs. While the traditional 'Open Topic' is being replaced by 'Focused Open Topics,' these are mission-driven solicitations addressing specific capability gaps where various solutions can compete. The program emphasizes dual-use technologies with both military and commercial applications. Specific topics include areas like High Temp Semiconductor Transistors for Hot DoW Environments and Electronic Warfare, F-16 Agnostic Rapid Weapons Integration, F-35 Agnostic Rapid Weapons Integration, Dynamic Open Systems Enclave, Automated Lethality, Integrating Neural Architectures for Brain-Inspired AI with Low SWAP, Ultra-Sensitive Quantum Telemetry Receiver, and Cost-Effective Composite Joints with Tailorable Performance and Geometry.

High Temp Semiconductor Transistors for Hot DoW Environments and Electronic Warfare (DAF26BZ05-DV030) is sponsored by Department of the Air Force (USAF). This topic solicits high temperature semiconductor electronics device and circuit solutions which can operate at temperatures at or above 500°C to address hot environment and electronic warfare needs. Proposed efforts should have already identified a clear application with a credible path to transition into the microelectronics defense industrial base.